© Semiconductor Components Industries, LLC, 2013
September, 2013 Rev. 8
1 Publication Order Number:
NB6N14S/D
NB6N14S
3.3 V 1:4 AnyLevelt
Differential Input to LVDS
Fanout Buffer/Translator
The NB6N14S is a differential 1:4 Clock or Data Receiver and will
accept AnyLevelt differential input signals: LVPECL, CML or
LVDS. These signals will be translated to LVDS and four identical
copies of Clock or Data will be distributed, operating up to 2.0 GHz or
2.5 Gb/s, respectively. As such, the NB6N14S is ideal for SONET,
GigE, Fiber Channel, Backplane and other Clock or Data distribution
applications.
The NB6N14S has a wide input common mode range from
GND + 50 mV to V
CC
50 mV. Combined with the 50 W internal
termination resistors at the inputs, the NB6N14S is ideal for
translating a variety of differential or singleended Clock or Data
signals to 350 mV typical LVDS output levels.
The NB6N14S is offered in a small 3 mm x 3 mm 16QFN
package. Application notes, models, and support documentation are
available at www.onsemi.com.
The NB6N14S is a member of the ECLinPS MAXt family of high
performance products.
Features
Maximum Input Clock Frequency > 2.0 GHz
Maximum Input Data Rate > 2.5 Gb/s
1 ps Maximum RMS Clock Jitter
Typically 10 ps Data Dependent Jitter
380 ps Typical Propagation Delay
120 ps Typical Rise and Fall Times
V
REF_AC
Reference Output
TIA/EIA 644 Compliant
Functionally Compatible with Existing 3.3 V LVEL, LVEP, EP, and
SG Devices
These are PbFree Devices
TIME (58 ps/div)
Figure 2. Typical Output Waveform at 2.488 Gb/s with
PRBS 2
231
(V
INPP
= 400 mV; Input Signal DDJ = 14 ps)
VOLTAGE (130 mV/div)
Device DDJ = 10 ps
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbFree Package
*For additional marking information, refer to
Application Note AND8002/D.
MARKING
DIAGRAM*
QFN16
MN SUFFIX
CASE 485G
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
16
NB6N
14S
ALYW G
G
1
Q3
Q3
Figure 1. Logic Diagram
Q2
Q2
Q1
Q1
Q0
Q0
EN DQ
(LVTTL/CMOS)
V
REF_AC
50
W
50
W
IN
VT
/IN
(Note: Microdot may be in either location)
1
+
R
PU
NB6N14S
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2
Figure 3. NB6N14S Pinout, 16pin QFN (Top View)
Q3 Q3
V
CC
EN
GND
IN
V
T
V
REF_AC
IN
Q1
Q1
Q2
Q2
5678
16 15 14 13
12
11
10
9
1
2
3
4
NB6N14S
Exposed Pad (EP)
Q0 Q0 V
CC
IN IN EN Q
01 10
10 11
x x 0 0 (Note 1)
1. On next transition of the input signal (IN).
Table 1. TRUTH TABLE
Q
1
0
1 (Note 1)
Table 2. PIN DESCRIPTION
Pin Name I/O Description
1 Q1 LVDS Output
Noninverted IN output. Typically loaded with 100 W receiver termination
resistor across differential pair.
2 Q1 LVDS Output
Inverted IN output. Typically loaded with 100 W receiver termination resistor
across differential pair.
3 Q2 LVDS Output
Noninverted IN output. Typically loaded with 100 W receiver termination
resistor across differential pair.
4 Q2 LVDS Output
Inverted IN output. Typically loaded with 100 W receiver termination resistor
across differential pair.
5 Q3 LVDS Output
Noninverted IN output. Typically loaded with 100 W receiver termination
resistor across differential pair.
6 Q3 LVDS Output
Inverted IN output. Typically loaded with 100 W receiver termination resistor
across differential pair.
7 V
CC
Positive Supply Voltage.
8 EN LVTTL / LVCMOS Input Synchronous Output Enable. When LOW, Q outputs will go LOW and Qb
outputs will go HIGH on the next negative transition of IN input. The internal
DFF register is clocked on the falling edge of IN input; see Figure 23. The EN
pin has an internal pullup resistor and defaults HIGH when left open.
9 IN LVPECL, CML, LVDS Inverted Differential Input
10 V
REF_AC
LVPECL Output The V
REF_AC
reference output can be used to rebias capacitorcoupled
differential or singleended input signals. For the capacitorcoupled IN and/or
INb inputs, V
REF_AC
should be connected to the VT pin and bypassed to
ground with a 0.01 mF capacitor.
11 V
T
LVPECL Output
Internal 100 W Centertapped Termination Pin for IN and IN
12 IN LVPECL, CML, LVDS Noninverted Differential Input. (Note 2)
13 GND Negative Supply Voltage.
14 V
CC
Positive Supply Voltage.
15 Q0 LVDS Output
Noninverted IN output. Typically loaded with 100 W receiver termination
resistor across differential pair.
16 Q0 LVDS Output
Inverted IN output. Typically loaded with 100 W receiver termination resistor
across differential pair.
EP The Exposed Pad (EP) on the QFN16 package bottom is thermally connected
to the die for improved heat transfer out of package. The exposed pad must be
attached to a heatsinking conduit. The pad is not electrically connected to the
die, but is recommended to be electrically and thermally connected to GND on
the PC board.
2. In the differential configuration, when the input termination pin (VT) is connected to a termination voltage or left open, and if no signal is applied
on IN/IN
inputs, then the device will be susceptible to selfoscillation.
NB6N14S
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3
Table 3. ATTRIBUTES
Characteristics Value
Moisture Sensitivity (Note 3) Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
ESD Protection Human Body Model
Machine Model
> 2 kV
> 200 V
EN Input Pullup Resistor R
PU
37 kW
Transistor Count 225
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V 3.8 V
V
IN
Positive Input GND = 0 V V
IN
V
CC
3.8 V
I
IN
Input Current Through R
T
(50 W Resistor)
Static
Surge
35
70
mA
mA
I
OSC
Output Short Circuit Current
LinetoLine (Q to Q
)
LinetoEnd (Q or Q to GND)
TIA/EIA 644 Compliant
Q or Q
Q to Q to GND
Continuous
Continuous
12
24
mA
I
REF_AC
V
REF_AC
Sink/Source Current "0.5 mA
T
A
Operating Temperature Range QFN16 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (JunctiontoAmbient) (Note 4) 0 lfpm
500 lfpm
QFN16
QFN16
41.6
35.2
°C/W
°C/W
q
JC
Thermal Resistance (JunctiontoCase) 1S2P (Note 4) QFN16 4.0 °C/W
T
sol
Wave Solder PbFree 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard multilayer board 1S2P (1 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB6N14SMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer HF LVDS FANOUT BUFF/ TRANS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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