LTC1502IS8-3.3#TRPBF

4
LTC1502-3.3
GND (Pin 4): Ground. Connect to a ground plane for best
performance.
V
IN
(Pin 5): Input Supply Voltage. Bypass V
IN
with a 10µF
low ESR capacitor to ground.
C3
(Pin 6): Charge Pump 2 (CP2) Flying Capacitor
Negative Terminal.
C3
+
(Pin 7): Charge Pump 2 Flying Capacitor Positive
Terminal.
V
OUT
(Pin 8): 3.3V Regulated Output Voltage. V
OUT
is
disconnected from V
IN
during shutdown. Bypass V
OUT
with a 10µF low ESR capacitor to ground.
PIN FUNCTIONS
UUU
C2 (Pin 1): Charge Pump 1 (CP1) Output. This pin also
serves as the input supply for charge pump 2 (CP2). To
ensure proper start-up, the C2 pin must not be externally
loaded. Bypass the C2 pin with a 10µF low ESR capacitor
to ground.
C1
+
(Pin 2): Charge Pump 1 Flying Capacitor Positive
Terminal.
C1
/SHDN (Pin 3): Charge Pump 1 Flying Capacitor Nega-
tive Terminal and Shutdown Input. Pulling this pin to
ground through a 100 resistor will put the part into
shutdown mode. With a high resistance pull-down FET,
the series resistor may be eliminated. The external pull-
down device must be high impedance for normal opera-
tion (see Applications Information). Peak voltage present
on this pin is approximately equal to V
IN
.
BLOCK DIAGRAM
W
+
+
+
TIMING
CONTROL
BIAS
CONTROL
1.2V
REF
CP2
C3C1
CP1
SHDN OSCEN
INTERNAL
V
CC
CLK1/CLK2
U3
U4
U2
C2
V
OUT
HIZ2
HIZ1
1M
1.2M
2.1M
C
OUT
C2
COMP2COMP3
COMP1
400k
0.55V
+
2.5µA
C1
/SHDN
SHUTDOWN
C1
+
C3
C3
+
V
IN
32
C2
1 6 7
V
OUT
8
V
IN
5
GND
1502-3.3 BD
4
C
IN
5
LTC1502-3.3
TEST CIRCUIT
APPLICATIONS INFORMATION
WUU
U
Regulator Operation
The LTC1502-3.3 uses a quadrupler charge pump DC/DC
converter to produce a boosted output voltage. The
quadrupler charge pump consists of two voltage doubler
charge pumps (CP1 and CP2 on the Block Diagram)
cascaded in series. CP1 doubles the input voltage V
IN
and
the CP1 output voltage is stored on external capacitor C2.
The C2 pin also serves as the input for doubler CP2 whose
output is stored on the output capacitor C
OUT
. Each
doubler is controlled by a two-phase clock which is
generated in the Timing Control circuit. On phase one of
the clock, the flying capacitors C1 and C3 are charged to
their respective input voltages. On phase two each charged
flying capacitor is stacked on top of the input voltage and
discharged through an internal switch onto its respective
output. This sequence of charging and discharging the
CP1 and CP2 flying capacitors continues at the free
running oscillator frequency (500kHz typ) until the output
is in regulation.
Regulation is achieved by comparing the divided down
output voltage to a fixed voltage reference. The charge
pump clocks are disabled when the output voltage is
above the desired regulation point set by COMP1. When
the output has dropped below the lower trip point of
COMP1, the charge pump clocks are turned back on until
V
OUT
is boosted back into regulation.
Enhanced Start-Up
Enhanced start-up capability is provided by the COMP2
circuitry. COMP2 compares the divided down C2 voltage
to the input voltage V
IN
. The COMP2 output disables the
output charge pump CP2 whenever the divided C2 voltage
is lower than V
IN
. The CP2 output is thereby forced into a
high impedance state until the voltage on C2 has been
raised above V
IN
(the C2 pin should not be loaded for
proper start-up). This allows a higher internal gate drive
voltage to be generated (from the C2 pin) before the output
(V
OUT
) is connected to a load. Hysteresis in COMP2 forces
CP2 to be turned ON and OFF while C
OUT
is charging up to
prevent a lockup condition if C2 droops too low during
start-up. By the time the output nears the regulation point,
the C2 voltage is well above the lower trip point of COMP2
and CP2 will remain enabled. This method of disabling the
output charge pump while an internal boosted gate drive
supply is developed allows the part to start up at low
voltages with a larger output current load than would
otherwise be possible.
Shutdown
Shutdown is implemented using an external pull-down
device on the C1
/SHDN pin. The recommended external
pull-down device is an open-drain FET with resistive cur-
rent limiting (see Figure 1). The pull-down device must sink
up to 300µA and pull down below 0.2V to ensure proper
shutdown operation, however, the actual series resistance
is not critical. The pull-down device must also go into a Hi-
Z state for the LTC1502-3.3 to become active.
The timing control circuitry forces the CP1 switches into
a high impedance state every 16 clock cycles. The Hi-Z
duration is equal to one clock cycle. At the end of the
Hi-Z time interval, the voltage on the C1
/SHDN pin is
sampled. If the C1
/SHDN pin has been pulled to a logic
low state, the part will go into shutdown mode. When the
pull-down device is disabled, an internal pull-up current
1
2
3
1502-3.3 TC
4
8
7
1µF
100
6
5
V
IN
GND
100pF
SWITCH
CLOSED FOR
SHUTDOWN
1µF
10µF
10µF
10µF
I
OUT
V
IN
LTC1502-3.3
C2
C1
+
C1
/SHDN
V
OUT
C3
+
C3
6
LTC1502-3.3
APPLICATIONS INFORMATION
WUU
U
1
2
3
1502-3.3 F01
4
V
CTRL
ON OFF
8
7
100
6
5
V
IN
GND
10µF
LTC1502-3.3
C2
C1
+
C1
/SHDN
V
OUT
C3
+
C3
Figure 1. Pull-Down Circuitry for Shutdown
will force a logic high on the C1
/SHDN pin and put the part
back into active mode. If no external pull-down is present
during the Hi-Z interval, the internal pull-up current will
maintain a logic high on the C1
/SHDN pin thereby keep-
ing the part in active mode.
The shutdown feature can be used to prevent charge pump
switching during noise sensitive intervals. Since the charge
pump oscillator is disabled during shutdown, output switch-
ing noise can be eliminated while the external pull-down is
active. The LTC1502-3.3 takes between 20µs and 50µs to
switch from shutdown to active mode once the pull-down
device has been turned off (assuming a 100pF external
capacitance to GND on the C1
/SHDN pin). A 100k pull-up
resistor from V
IN
to C1
/SHDN will speed up this transition
by a factor of five at the expense of 10µA or so of additional
shutdown current. To maintain regulation, a sufficiently
large output capacitor must be used to prevent excessive
V
OUT
droop while the charge pump is in shutdown. Also,
there must be adequate time for the charge pump to
recharge the output capacitor while the part is active. In
other words, the average load current must be low enough
for the LTC1502-3.3 to maintain a 3.3V output while the
part is active.
Capacitor Selection
For best performance, it is recommended that low ESR
capacitors be used for C
IN
, C2 and C
OUT
to reduce noise
and ripple. The C
IN
, C2 and C
OUT
capacitors should be
either ceramic or tantalum and should be 10µF or greater.
If the input source impedance is very low (<0.5), C
IN
may not be needed. Ceramic capacitors are recommended
for the flying capacitors C1 and C3 with values of 0.47µF
to 2.2µF. Smaller values may be used in low output current
applications (e.g., I
OUT
< 1mA).
Output Ripple
Normal LTC1502-3.3 operation produces voltage ripple
on the V
OUT
pin. Output voltage ripple is required for
regulation. Low frequency ripple exists due to the hyster-
esis in the sense comparator and propagation
delays in the charge pump enable/disable circuits. High
frequency ripple is also present mainly from the ESR
(equivalent series resistance) in the output capacitor. Typi-
cal output ripple (V
IN
= 1.25V) under maximum load is
50mV peak-to-peak with a low ESR 10µF output capacitor.
The magnitude of the ripple voltage depends on several
factors. High input voltages increase the output ripple
since more charge is delivered to C
OUT
per charging cycle.
Large output current load and/or a small output capacitor
(<10µF) results in higher ripple due to higher output
voltage dV/dt. High ESR capacitors (ESR > 0.5) on the
output pin cause high frequency voltage spikes on V
OUT
with every clock cycle.
There are several ways to reduce the output voltage ripple.
A larger C
OUT
capacitor (22µF or greater) will reduce both
the low and high frequency ripple due to the lower C
OUT
charging and discharging dV/dt and the lower ESR typi-
cally found with higher value (larger case size) capacitors.
A low ESR ceramic output capacitor will minimize the high
frequency ripple, but will not reduce the low frequency
ripple unless a high capacitance value is chosen. A reason-
able compromise is to use a 10µF to 22µF tantalum
capacitor in parallel with a 1µF to 3.3µF ceramic capacitor
on V
OUT
to reduce both the low and high frequency ripple.
An RC filter may also be used to reduce high frequency
voltage spikes (see Figure 2).
LTC1502-3.3
10µF
TANTALUM
V
OUT
V
OUT
V
OUT
1µF
CERAMIC
2
8
8
10µF10µF
V
OUT
1502-3.3 F02
+
+ +
LTC1502-3.3
Figure 2. Output Ripple Reduction Techniques

LTC1502IS8-3.3#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 1x Cell to 3.3V Reg Ch Pump DC/DC Conv
Lifecycle:
New from this manufacturer.
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