2
FN8222.3
July 20, 2009
Ordering Information
PART
NUMBER
PART
MARKING
R
TOTAL
(kΩ)
TEMP RANGE
(°C) PACKAGE
PACKAGE
DWG. #
X9C102P X9C102P 1 0 to +70 8 Ld PDIP MDP0031
X9C102PZ (Notes 1, 2) X9C102P Z 0 to +70 8 Ld PDIP (Pb-free) MDP0031
X9C102PI X9C102P I -40 to +85 8 Ld PDIP MDP0031
X9C102PIZ (Notes 1, 2) X9C102P ZI -40 to +85 8 Ld PDIP (Pb-free) MDP0031
X9C102S*
,
** X9C102S 0 to +70 8 Ld SOIC MDP0027
X9C102SZ* (Note 1) X9C102S Z 0 to +70 8 Ld SOIC (Pb-free) MDP0027
X9C102SI*
,
** X9C102S I -40 to +85 8 Ld SOIC MDP0027
X9C102SIZ*
,
** (Note 1) X9C102S ZI -40 to +85 8 Ld SOIC (Pb-free) MDP0027
X9C103P X9C103P 10 0 to +70 8 Ld PDIP MDP0031
X9C103PZ (Notes 1, 2) X9C103P Z 0 to +70 8 Ld PDIP (Pb-free) MDP0031
X9C103PI X9C103P I -40 to +85 8 Ld PDIP MDP0031
X9C103PIZ (Note 1) X9C103P ZI -40 to +85 8 Ld PDIP (Pb-free) MDP0031
X9C103S*
,
** X9C103S 0 to +70 8 Ld SOIC MDP0027
X9C103SZ*
,
** (Note 1) X9C103S Z 0 to +70 8 Ld SOIC (Pb-free) MDP0027
X9C103SI*
,
** X9C103S I -40 to +85 8 Ld SOIC MDP0027
X9C103SIZ*
,
** (Note 1) X9C103S ZI -40 to +85 8 Ld SOIC (Pb-free) MDP0027
X9C503P X9C503P 50 0 to +70 8 Ld PDIP MDP0031
X9C503PZ (Notes 1, 2) X9C503P Z 0 to +70 8 Ld PDIP (Pb-free) MDP0031
X9C503PI X9C503P I -40 to +85 8 Ld PDIP MDP0031
X9C503PIZ (Notes 1, 2) X9C503P ZI -40 to +85 8 Ld PDIP (Pb-free) MDP0031
X9C503S* X9C503S 0 to +70 8 Ld SOIC MDP0027
X9C503SZ* (Note 1) X9C503S Z 0 to +70 8 Ld SOIC (Pb-free) MDP0027
X9C503SI*
,
** X9C503S I -40 to +85 8 Ld SOIC MDP0027
X9C503SIZ*
,
** (Note 1) X9C503S ZI -40 to +85 8 Ld SOIC (Pb-free) MDP0027
X9C104P X9C104P 100 0 to +70 8 Ld PDIP MDP0031
X9C104PI X9C104P I -40 to +85 8 Ld PDIP MDP0031
X9C104PIZ (Notes 1, 2) X9C104P ZI -40 to +85 8 Ld PDIP (Pb-free) MDP0031
X9C104S*
,
** X9C104S 0 to +70 8 Ld SOIC MDP0027
X9C104SZ*
,
** (Note 1) X9C104S Z 0 to +70 8 Ld SOIC (Pb-free) MDP0027
X9C104SI*
,
** X9C104S I -40 to +85 8 Ld SOIC MDP0027
X9C104SIZ*
,
** (Note 1) X9C104S ZI -40 to +85 8 Ld SOIC (Pb-free) MDP0027
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
**Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
X9C102, X9C103, X9C104, X9C503