Description
This series of bi-color ChipLEDs is designed with the small-
est footprint to achieve high density of components on
board. They have the industry standard footprint of 1.6
mm x 0.8 mm and a height of only 0.5 mm. This makes
them very suitable for cellular phone and mobile equip-
ment backlighting and indication. They are available in
a wide range of color combinations. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel. These
parts are compatible with reflow soldering.
HSMF-C16x
Miniature Bi-Color Surface Mount ChipLEDs
Data Sheet
Features
• Small size
• 0603 industry standard footprint
• Diffused optics
• Operating temperature range of –40° C to +85° C
• Compatible with reflow soldering
• Available in various color combination
• Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
• Keypad backlighting
• Symbol indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre-
cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Part Number Color Package Description
HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diffused
HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diffused
HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diffused
HSMF-C165 High Efficiency Red / GaP Green Untinted, Diffused
HSMF-C166 GaP Yellow / GaP Green Untinted, Diffused
HSMF-C167 GaP Orange / GaP Green Untinted, Diffused
HSMF-C168 InGaN Green / InGaN Blue Untinted, Diffused
HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diffused