HSMF-C165

Description
This series of bi-color ChipLEDs is designed with the small-
est footprint to achieve high density of components on
board. They have the industry standard footprint of 1.6
mm x 0.8 mm and a height of only 0.5 mm. This makes
them very suitable for cellular phone and mobile equip-
ment backlighting and indication. They are available in
a wide range of color combinations. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel. These
parts are compatible with reflow soldering.
HSMF-C16x
Miniature Bi-Color Surface Mount ChipLEDs
Data Sheet
Features
Small size
0603 industry standard footprint
Diffused optics
Operating temperature range of –40° C to +85° C
Compatible with reflow soldering
Available in various color combination
Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
Keypad backlighting
Symbol indicator
LCD backlighting
Pushbutton backlighting
Front panel indicator
CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre-
cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Part Number Color Package Description
HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diffused
HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diffused
HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diffused
HSMF-C165 High Efficiency Red / GaP Green Untinted, Diffused
HSMF-C166 GaP Yellow / GaP Green Untinted, Diffused
HSMF-C167 GaP Orange / GaP Green Untinted, Diffused
HSMF-C168 InGaN Green / InGaN Blue Untinted, Diffused
HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diffused
2
Package Dimensions
Absolute Maximum Ratings for Each Die at T
A
= 25° C
Parameter AlInGaP InGaN GaP Units
DC Forward Current
[1]
20 10 20 mA
Power Dissipation 48 38 52 mW
Reverse Voltage 5 5 5 V
LED Junction Temperature 95 95 95 ˚C
Operating Temperature Range –40 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figure 6 & 7)
Note:
1. Derate linearly as shown in Figure 4.
1.6
(0.063†)
0.16 (0.006)
0.5 (0.020)
0.4
(0.016)
LED DIES
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINALS
0.8 (0.031)
CATHODE LINE
0.3 (0.012)
CATHODE LINE
1
2
3
4
POLARITY
1 3
HSMF-C162
AMBER
2 4 RED
HSMF-C163
GREEN
RED
HSMF-C164
BLUE
RED
HSMF-C165
GREEN
RED
HSMF-C166
GREEN
YELLOW
HSMF-C167
GREEN
ORANGE
HSMF-C168
BLUE
GREEN
HSMF-C169
BLUE
AMBER
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS INCHES.
2. TOLERANCE IS ± 0.1 MM ± 0.004 IN. UNLESS OTHERWISE SPECIFIED.
3
Electrical Characteristics at T
A
= 25° C
Reverse
Breakdown Capacitance Thermal
Forward Voltage V
R
(Volts) C (pF), @ V
F
= 0, Resistance
V
F
(Volts) @ I
F
[1]
@ I
R
= 100 µA f = 1 MHz Rθ
J-PIN
(
°C
/W)
Color Typ. Max. Min. Typ. Typ.
AlInGaP Red 20 mA 1.9 2.4 5 15 300
AlInGaP Amber 20 mA 1.9 2.4 5 11 300
AlInGaP Red
[2]
10 mA 1.8 2.3 5 15 300
AlInGaP Amber
[2]
10 mA 1.8 2.3 5 11 300
InGaN Green 10 mA 3.4 3.8 5 35 500
InGaN Blue 10 mA 3.4 3.8 5 35 500
HER 20 mA 1.95 2.6 5 5 325
GaP Orange 20 mA 2.2 2.6 5 7 325
GaP Yellow 20 mA 2.1 2.6 5 6 325
GaP Green 20 mA 2.2 2.6 5 9 325
Optical Characteristics at T
A
= 25° C
Color
Peak Dominant Luminous
Luminous Intensity Wavelength Wavelength Viewing Angle Efficacy
I
v
(mcd) @ I
F
[1]
λ
peak
(nm) λ
d
[2]
(nm) 2 θ
1/2
Degrees
[3]
η
v
(lm/W)
Color Min. Typ. Typ. Typ. Typ. Typ.
AlInGaP Red 20 mA 28.5 90 637 626 120 155
AlInGaP Amber 20 mA 28.5 90 595 592 120 480
AlInGaP Red
[4]
10 mA 11.2 35 637 626 120 155
AlInGaP Amber
[4]
10 mA 11.2 35 595 592 120 480
InGaN Green 10 mA 18 45 523 525 120 500
InGaN Blue 10 mA 2.8 10 468 470 120 80
HER 20 mA 2.8 10 636 621 120 145
GaP Orange 20 mA 2.8 8 605 604 120 380
GaP Yellow 20 mA 2.8 8 589 586 120 500
GaP Green 20 mA 4.5 15 570 572 120 595
Notes:
1. V
F
Tolerance: ± 0.1 V.
2. The product testing is based on 20 mA. This is for reference only.
Notes:
1. The luminous intensity I
v
is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength λ
d
is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3. θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. The product testing is based on 20 mA. This is for reference purpose.

HSMF-C165

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Standard LEDs - SMD Grn/Red Bi-Colo
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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