Type
IPB081N06L3 G IPP084N06L3 G
IPI084N06L3 G
OptiMOS
3 Power-Transistor
Features
• Ideal for high frequency switching and sync. rec.
• Optimized technology for DC/DC converters
• Excellent gate charge x R
DS(on)
product (FOM)
• N-channel, logic level
• 100% avalanche tested
• Pb-free plating; RoHS compliant
• Qualified according to JEDEC
1)
for target applications
• Halogen-free according to IEC61249-2-21
V
DS
60 V
R
DS(on),max (SMD)
8.1
mΩ
I
D
50 A
Product Summary
Type IPB081N06L3 G IPP084N06L3 G IPI084N06L3 G
Package PG-TO263-3 PG-TO220-3 PG-TO262-3
Rev. 2.24 page 1 2012-11-28
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
T
C
=25 °C
2)
50 A
T
C
=100 °C
50
Pulsed drain current
3)
I
D,pulse
T
C
=25 °C
200
Avalanche energy, single pulse
4)
E
AS
I
D
=50 A, R
GS
=25 Ω
43 mJ
Gate source voltage
V
GS
±20 V
Power dissipation
P
tot
T
C
=25 °C
79 W
Operating and storage temperature
T
j
, T
stg
-55 ... 175 °C
4)
See figure 13 for more detailed information
Value
1)
J-STD20 and JESD22
2)
Current is limited by bondwire; with an R
thJC
=1.9 K/W the chip is able to carry 73 A.
3)
See figure 3 for more detailed information
Package PG-TO263-3 PG-TO220-3 PG-TO262-3
Marking 081N06L 084N06L 084N06L
Rev. 2.24 page 1 2012-11-28
IPB081N06L3 G IPP084N06L3 G
IPI084N06L3 G
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case
R
thJC
- - 1.9 K/W
Thermal resistance,
R
thJA
minimal footprint - - 62
junction - ambient
6 cm² cooling area
5)
--40
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=1 mA
60 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=34 µA
1.2 1.7 2.2
Zero gate voltage drain current
I
DSS
V
DS
=60 V, V
GS
=0 V,
T
j
=25 °C
- 0.1 1 µA
V
DS
=60 V, V
GS
=0 V,
T
j
=125 °C
- 10 100
Values
Rev. 2.24 page 2 2012-11-28
Gate-source leakage current
I
GSS
V
GS
=20 V, V
DS
=0 V
- 1 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=10 V, I
D
=50 A
- 7.0 8.4
mΩ
V
GS
=4.5 V, I
D
=25 A
- 9.7 14.3
Drain-source on-state resistance
R
DS(on)
V
GS
=10 V, I
D
=50 A,
(SMD)
- 6.7 8.1
V
GS
=4.5 V, I
D
=25 A,
(SMD)
- 9.4 14
Gate resistance
R
G
- 0.9 -
Ω
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=50 A
35 69 - S
5)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.24 page 2 2012-11-28
IPB081N06L3 G IPP084N06L3 G
IPI084N06L3 G
Parameter Symbol Conditions Unit
min. typ. max.
D
y
namic characteristics
Input capacitance
C
iss
- 3700 4900 pF
Output capacitance
C
oss
- 690 920
Reverse transfer capacitance
C
rss
-31-
Turn-on delay time
t
d(on)
-15-ns
Rise time
t
r
-26-
Turn-off delay time
t
d(off)
-37-
Fall time
t
f
-7-
Gate Char
g
e Characteristics
6)
Gate to source charge
Q
gs
-14-nC
Gate to drain charge
Q
gd
-5-
Switching charge
Q
sw
-12-
Gate charge total
Q
g
-2229
Values
V
GS
=0 V, V
DS
=30 V,
f=1 MHz
V
DD
=30 V, V
GS
=10 V,
I
D
=20 A, R
G
=1.6 Ω
V
DD
=30 V, I
D
=50 A,
V
GS
=0 to 4.5 V
Rev. 2.24 page 3 2012-11-28
g
g
Gate plateau voltage
V
plateau
- 3.8 - V
Output charge
Q
oss
V
DD
=30 V, V
GS
=0 V
-3445nC
Reverse Diode
Diode continous forward current
I
S
- - 50 A
Diode pulse current
I
S,pulse
- - 200
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=50 A,
T
j
=25 °C
- 1.0 1.2 V
Reverse recovery time
t
rr
-40-ns
Reverse recovery charge
Q
rr
-39-nC
6)
See figure 16 for gate charge parameter definition
V
R
=30 V, I
F
=20A,
di
F
/dt=100 A/µs
T
C
=25 °C
Rev. 2.24 page 3 2012-11-28

DCP69-13

Mfr. #:
Manufacturer:
Diodes Incorporated
Description:
Bipolar Transistors - BJT 1W -20V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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