4
FN3281.10
November 20, 2006
Absolute Maximum Ratings Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V
GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V
GND to V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+34V
Digital Inputs, V
S
, V
D
(Note 1)
. . . . . . . . (V-) -2V to (V+) + 2V or 30mA, Whichever Occurs First
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Signal Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V (Max)
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V (Min)
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .≤20ns
Thermal Resistance (Typical, Note 2) θ
JA
(°C/W)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Maximum Junction Temperature (Plastic Packages) . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
(SOIC and TSSOP- Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Signals on S
X
, D
X
or IN
X
exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
2. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications (Dual Supply) Test Conditions: V+ = +15V, V- = -15V, V
IN
= 2.4V, 0.8V, V
ANALOG
= V
S
, V
D
,
Unless Otherwise Specified
PARAMETER TEST CONDITIONS
TEMP
(°C) MIN
(NOTE 3)
TYP MAX UNITS
DYNAMIC CHARACTERISTICS
Turn-ON Time, t
ON
R
L
= 1kΩ, C
L
= 35pF, V
S
= ±10V, (Figure 1) +25 - 150 250 ns
Turn-OFF Time, t
OFF
DG441 +25 - 90 120 ns
DG442 - 110 210 ns
Charge Injection, Q (Figure 2) C
L
= 1nF, V
G
= 0V, R
G
= 0Ω +25 - -1 - pC
OFF Isolation (Figure 4) R
L
= 50Ω, C
L
= 5pF, f = 1MHz +25 - 60 - dB
Crosstalk (Channel-to-Channel) (Figure 3) +25 - -100 - dB
Source OFF Capacitance, C
S(OFF)
f = 1MHz, V
ANALOG
= 0 (Figure 5) +25 - 4 - pF
Drain OFF Capacitance, C
D(OFF)
+25 - 4 - pF
Channel ON Capacitance,
C
D(ON)
+C
S(ON)
+25 - 16 - pF
DIGITAL INPUT CHARACTERISTICS
Input Current V
IN
Low, I
IL
V
IN
Under Test = 0.8V, All Others = 2.4V Full -0.5 -0.00001 0.5 μA
Input Current V
IN
High, I
IH
V
IN
Under Test = 2.4V, All Others = 0.8V Full -0.5 0.00001 0.5 μA
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, V
ANALOG
Full -15 - 15 V
Drain-Source ON Resistance, r
DS(ON
)I
S
= 10mA, V
D
= ±8.5V, V+ = 13.5V,
V- = -13.5V
+25 - 50 85 Ω
+85 - - 100 Ω
Source OFF Leakage Current, I
S(OFF)
V+ = 16.5V, V- = -16.5V, V
D
= ±15.5V,
V
S
= 15.5V
+25 -0.5 0.01 0.5 nA
+85 -5 - 5 nA
Drain OFF Leakage Current, I
D(OFF)
+25 -0.5 0.01 0.5 nA
+85 -5 - 5 nA
Channel ON Leakage Current,
I
D(ON)
+I
S(ON)
V+ = 16.5V, V- = -16.5V, V
S
= V
D
= ±15.5V +25 -0.5 0.08 0.5 nA
+85 -10 - 10 nA
DG441, DG442
