LT3585-0/LT3585-1
LT3585-2/LT3585-3
13
3585f
APPLICATIO S I FOR ATIO
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IGBT Drive
The IGBT is a high current switch for the 100A+ current
through the photofl ash lamp. To create a redeye effect or
to adjust the light output, the lamp current needs to be
stopped or quenched with an IGBT before discharging
the photofl ash capacitor fully. The IGBT device also con-
trols the 4kV trigger pulse required to ionize the Xenon
gas in the photofl ash lamp. Figure 8 is a schematic of a
fully functional photofl ash application with the LT3585-0
serving as the IGBT driver. An IGBT driver charges the
gate capacitance to start the fl ash. The IGBT driver does
not need to pull up the gate signifi cantly fast because of
the inherently slow nature of the IGBT. A rise time of 2µs
is suffi cient to charge the gate of the IGBT and create a
trigger pulse. With slower rise times, the trigger circuitry
will not have a fast enough edge to create the required
4kV pulse. The fall time of the IGBT driver is critical to the
Fi
gure
6
.
IGBT
D
r
i
ver
O
u
t
pu
t
w
ith
4000
p
F
L
oa
d
Fi
gure
7
.
IGBT
T
urn-
Off
D
e
l
ay vs
R
PD
Table 3. Recommended Output Diodes
PART
MAX REVERSE
VOLTAGE (V)
MAX CONTINUOUS
FORWARD CURRENT (mA) CAPACITANCE (pF) VENDOR
GSD2004S
(DUAL DIODE)
2 × 300 225 5 Vishay
(402) 563-6866
www.vishay.com
CMSD2004S
(DUAL DIODE)
2 × 300 225 5 Central Semiconductor
(631) 435-1110
www.centralsemi.con
MMBD3004S
(DUAL DIODE)
2 × 350 225 5 Diodes, Inc
(816) 251-8800
www.diodes.com
safe operation of the IGBT. The IGBT gate is a network of
resistors and capacitors, as shown in Figure 9. When the
gate terminal is pulled low, the capacitance closest to the
terminal goes low but the capacitance further from the
terminal remains high. This causes a smaller portion of
the device to handle a larger portion of the current, which
can damage the device. The pull-down circuitry needs to
pull down slower than the internal RC time constant in
the gate of the IGBT. This is easily accomplished with a
resistor placed in series with the IGBTPD pin.
The LT3585 series integrated IGBT drive circuit is indepen-
dent of the charging function and draws its power from
the IGBTPWR pin. The drive pulls high to within 200mV
of IGBTPWR and pulls down to 100mV. The circuit’s
switching waveform is shown in Figure 6. The rise and fall
times are measured using a 4000pF output capacitor. The
typical 10% to 90% rise time is 320ns when IGBTPWR
IGBTIN
1V/DIV
IGBTOUT
2V/DIV
500ns/DIV
3585 F06
I
GBTPWR
= 5V
C
OUT
= 4000pF
R
PD
= 50
R
PD
()
0
0
FALL TIME (µs)
0.2
0.6
0.8
1.0
2.0
1.4
50
100
3585 F07
0.4
1.6
1.8
1.2
150
200
LT3585-0/LT3585-1
LT3585-2/LT3585-3
14
3585f
Table 4. Recommended IGBTs
PART DRIVE VOLTAGE (V) BREAKDOWN VOLTAGE (V)
COLLECTOR CURRENT
(PULSED) (A) VENDOR
CY25CAH-8F*
CY25CAJ-8F*
CY25BAH-8F
CY25BAJ-8F
2.5
4
2.5
4
400
400
400
400
150
150
150
150
Renesas
(408) 382-7500
www.renesas.com
GT8G133 4 400 150 Toshiba Semiconductor
(949) 623-2900
www.semicon.toshiba.co.jp/eng
*Packaged in 8-lead VSON-8 pacakge.
APPLICATIO S I FOR ATIO
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Figure 8. Complete Xenon Circuit
EMITTER
3585 F09
GATE
Figure 9. IGBT Gate
is 5V and IGBTIN is driven by a 5V signal. The typical
90% to 10% fall time is 125ns but varies with R
PD
given
by Figure 7. The IGBT driver pulls a peak of 50mA when
driving an IGBT with minimal quiescent current. In the
low state, an active pull-down network is used during the
initial transition but is deactivated after an internal time
constant. This allows the IGBT driver’s quiescent current
to drop to approximately 0.1µA during idle conditions.
The pull-down circuit will clamp the output below 0.8V for
currents not exceeding 10mA in its idle state. The pull-up
network is always active when the IGBTIN is greater than
1.5V. Table 4 is a list of recommended IGBT devices for
strobe applications. These devices are all packaged in
8-lead TSSOP packages unless otherwise noted.
A
C
+
DONE
CHRG/IADJ
V
IN
IGBTPWR
IGBTIN
IGBTPU
IGBTPD
V
BAT
SW
GND
LT3585-0
320V
DANGER HIGH VOLTAGE! OPERATION BY HIGH VOLTAGE TRAINED PERSONNEL ONLY
TO GATE OF IGBT
3585 F08
C2
50 F
PHOTOFLASH
CAPACITOR
C3
0.22 F
C1
4.7 F
V
IN
5V
V
BAT
2 AA OR
1 TO 2 Li-Ion
D1
1
2
4
5
T1
1:10:2
R
PD
20 TO 160
C4
2.2 F
600V
R1
1M
FLASHLAMP
TRIGGER T
1
2
3
LT3585-0/LT3585-1
LT3585-2/LT3585-3
15
3585f
APPLICATIO S I FOR ATIO
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Board Layout
The high voltage operation of these parts demand care-
ful attention to board layout. You will not get advertised
performance with careless layout. Figure 10 shows the
recommended component placement. Keep the area for the
high voltage end of the secondary as small as possible. Also
note the larger than minimum spacing for all high voltage
nodes in order to meet breakdown voltage requirements for
the circuit board. It is imperative to keep the electrical path
formed by C1, the primary of T1, and the LT3585 series IC
as short as possible. If this path is haphazardly made long,
Figure 10. LT3585 Suggested Layout
it will effectively increase the leakage inductance of T1,
which may result in an overvoltage condition on the SW
pin. The CHRG/IADJ pin trace should be kept as short as
possible while minimizing the adjacent edge with the SW
pin trace. This will eliminate false toggling of the CHRG/IADJ
pin during sharp transitions on the SW pin. Thermal vias
should be added underneath the Exposed Pad, Pin 11, to
enhance the LT3585’s thermal performance. These vias
should go directly to a large area of ground plane. Acting
as a heat sink, the thermal vias/ground plane will lower
the device’s operating temperature.
1
2
3
4
5
10
9
8
7
6
11
THERMAL
VIAS
IGBTIN
V
OUT
D1 (DUAL DIODE)
PHOTOFLASH
CAPACITOR
IGBTPWR
GND
V
IN
V
BAT
V
BAT
C2
C1
3585 F10
T1
R2
R1
GND
DONE CHRG
TO GATE OF IGBT

LT3585EDDB-3#TRMPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Power Management Specialized - PMIC Photoflash Chr w/ Adj In C & IGBT Drvr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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