Vishay Semiconductors
VLMW320.
Document Number 81213
Rev. 1.2, 30-Jul-08
www.vishay.com
9
For technical support, please contact: LED@vishay.com
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
SOLDERING PROFILE
BAR CODE PRODUCT LABEL
EXAMPLE:
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: V1 = code for luminous intensity group
5L = code for chrom. coordinate group
D) Date code year/week
E) Day code (e. g. 1: Monday)
F) Batch no.
G) Total quantity
H) Company code
Figure 12. Reel Dimensions - GS08
Figure 13. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
Figure 14. Double Wave Soldering of Opto Devices (all Packages)
180
178
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
14.4 max.
10.0
9.0
120°
94 8665
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
0
50
100
150
200
250
300
0 50 100 150 200
250 300
245 °C
max. 260 °C
max. 120 s
max. 100 s
max. 30 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
255 °C
19470-3
max. 2 cycles allowed
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
235 to 260 °C
2 K/s
ca. 200 K/s
second
wave
first wave
5 s
full line: typical
dotted line: process limits
Time (s)
Temperature (°C)
lead temperature
300
250
200
150
100
50
0
0 50 100 150 200 250
948626-1
TTW Soldering (acc. to CECC00802)
100 to 130 °C
forced cooling
ca. 2 K/s
ca. 5 K/s
106
37
A
H
BC D E F G
19795
