NCP5623B
www.onsemi.com
12
PACKAGE DIMENSIONS
LLGA12, 2x2
CASE 513AA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
D2
E2
C
C0.10
C0.10
C0.08
12X
A1
SEATING
PLANE
e/2
e
11X
K
NOTE 3
b
12X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.50 0.60
A1 0.00 0.05
b 0.15 0.20
D 2.00 BSC
D2 0.80 1.00
E 2.00 BSC
E2 0.55 0.65
e 0.40 BSC
K 0.25 −−−
L 0.30 0.50
2
6
11
7
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L1 0.40 0.50
1
12
L1
2.30
0.40
PITCH
0.98
0.70
0.63
11X
0.73
1.06
1
1.15
0.25
12X
DIMENSIONS: MILLIMETERS
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NCP5623B/D
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