TMP35/TMP36/TMP37 Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
1, 2
Rating
Supply Voltage 7 V
SHUTDOWN
S
Output Pin GND ≤ V
OUT
≤ +V
S
Operating Temperature Range −55°C to +150°C
Die Junction Temperature 175°C
Storage Temperature Range −65°C to +160°C
IR Reflow Soldering
Time at Peak Temperature Range 10 sec to 20 sec
Ramp-Up Rate 3°C/sec
Ramp-Down Rate −6°C/sec
Time 25°C to Peak Temperature 6 min
IR Reflow Soldering—Pb-Free Package
Peak Temperature 260°C (0°C)
Time at Peak Temperature Range 20 sec to 40 sec
Ramp-Up Rate 3°C/sec
Ramp-Down Rate −6°C/sec
Time 25°C to Peak Temperature 8 min
1
Digital inputs are protected; however, permanent damage can occur on
unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper
antistatic handling procedures.
2
Remove power before inserting or removing units from their sockets.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device in
socket.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
TO-92 (T-3-1) 162 120 °C/W
SOIC_N (R-8) 158 43 °C/W
SOT-23 (RJ-5) 300 180 °C/W
ESD CAUTION
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