EMIF08-1502M16 Package information
5/10
3 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3. Micro QFN 3.3x1.5 16L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.50 0.55 0.60 0.020 0.022 0.024
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.15 0.20 0.25 0.006 0.008 0.010
D 3.20 3.30 3.40 0.126 0.130 0.134
D2 2.45 2.60 2.70 0.096 0.102 0.106
E 1.40 1.50 1.60 0.055 0.059 0.063
E2 0.20 0.35 0.45 0.008 0.014 0.018
e 0.40 0.016
K0.20 0.008
L 0.20 0.30 0.40 0.008 0.012 0.016
Figure 9. Micro QFN 3.3x1.5 16L
footprint (dimensions in mm)
Figure 10. Marking
D
INDEX AREA
(D/2 x E/2)
TOP VIEW
SIDE VIEW
BOTTOM VIEW
E
A
e
D2
L
b
K
E2
A1
INDEX AREA
(D/2 x E/2)
EXPOSED PAD
PIN # 1 ID
0.40
0.60
0.35
0.20
2.60
0.275
XX
WW
YP
XX
WW
YP
XX
WW
YP
Dot : Pin 1 Identification
X X= Marking
WW= DataCode (week)
Y=Data code(Year)
P=Assembly plant
