© Semiconductor Components Industries, LLC, 2013
August, 2016 − Rev. 7
1 Publication Order Number:
NTLJD3115P/D
NTLJD3115P
Power MOSFET
−20 V, −4.1 A, Dual P−Channel, 2x2 mm
WDFN Package
Features
• WDFN Package Provides Exposed Drain Pad for Excellent Thermal
Conduction
• 2x2 mm Footprint Same as SC−88
• Lowest R
DS(on)
Solution in 2x2 mm Package
• 1.8 V R
DS(on)
Rating for Operation at Low Voltage Gate Drive Logic
Level
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• Bidirectional Current Flow with Common Source Configuration
• This is a Pb−Free Device
Applications
• Optimized for Battery and Load Management Applications in
Portable Equipment
• Li−Ion Battery Charging and Protection Circuits
• High Side Load Switch
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter Symbol Value Unit
Drain−to−Source Voltage V
DSS
−20 V
Gate−to−Source Voltage V
GS
±8.0 V
Continuous Drain
Current (Note 1)
Steady
State
T
A
= 25°C
I
D
−3.3
A
T
A
= 85°C −2.4
t ≤ 5 s T
A
= 25°C −4.1
Power Dissipation
(Note 1)
Steady
State
T
A
= 25°C
P
D
1.5
W
t ≤ 5 s 2.3
Continuous Drain
Current (Note 2)
Steady
State
T
A
= 25°C
I
D
−2.3
A
T
A
= 85°C −1.6
Power Dissipation
(Note 2)
T
A
= 25°C
P
D
0.71 W
Pulsed Drain Current
t
p
= 10 ms
I
DM
−20 A
Operating Junction and Storage Temperature T
J
, T
STG
−55 to
150
°C
Source Current (Body Diode) (Note 2) I
S
−1.9 A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm
2
, 2 oz Cu.
www.onsemi.com
−20 V
135 mW @ −2.5 V
100 mW @ −4.5 V
R
DS(on)
MAX
−4.1 A
I
D
MAX (Note 1)V
(BR)DSS
200 mW @ −1.8 V
G1
S1
P−CHANNEL MOSFET
D1
JD = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
JDMG
G
1
2
3
6
5
4
WDFN6
CASE 506AN
MARKING
DIAGRAM
Device Package Shipping
†
ORDERING INFORMATION
NTLJD3115PT1G WDFN6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
D2
D1
Pin 1
G2
S2
P−CHANNEL MOSFET
D2
1
2
3
6
5
4
S1
G1
D2
D1
G2
S2
(Top View)
PIN CONNECTIONS
D1
D2
NTLJD3115PTAG WDFN6
(Pb−Free)
3000/Tape & Reel
