MAX3736ETE+T

MAX3736
Laser Safety and IEC 825
Using the MAX3736 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections
must be considered. Customers must determine the
level of fault tolerance required by their application.
Please recognize that Maxim products are not
designed or authorized for use as components in sys-
tems intended for surgical implant into the body, for
applications intended to support or sustain life, or for
any other application where the failure of a Maxim
product could create a situation where personal injury
or death may occur.
Chip Information
PROCESS: SiGe BiPOLAR
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
10 ______________________________________________________________________________________
16
1
2
3
4
12
11
10
9
15 14 13
5678
DIS
V
CC
GND
GND
V
CC
OUT-
OUT+
EP
V
CC
IN+
IN-
V
CC
THE EXPOSED PAD MUST BE CONNECTED TO GROUND
FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE.
BIASSET
MODSET
THIN QFN (3mm x 3mm)
BC_MON
BIAS
V
CC
TOP VIEW
MAX3736
Pin Configuration
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 TQFN-EP T1633-2
21-0136 90-0030
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
11
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0 12/03 Initial release
1 2/06 Added lead(Pb)-free part to the Ordering Information table 1
2 9/10
Removed the dice package from the Ordering Information table and the Electrical
Characteristics table Note 1; removed the Wire-Bonding Die, Chip Topography/Pad
Configuration, Chip Topography, and Bonding Coordinates sections and Table 1; added
the soldering information for leaded and lead-free packages to the Absolute Maximum
Ratings section; added the Package Information table
1, 2, 3, 9,
10, 11

MAX3736ETE+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Laser Drivers 3.2Gbps Low-Power SFP Laser Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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