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CPC1998J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
DS-CPC1998-R05 www.ixysic.com 1
e
3
Characteristics
Features
• Load Current up to 20A
rms
with 5°C/W Heat Sink
• 800V
P
Blocking Voltage
• 5mA Control Current
• Zero-Cross Switching
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• 2500V
rms
Isolation, Input to Output
• DC Control, AC Output
• Optically Isolated
• TTL and CMOS Compatible
• Low EMI and RFI Generation
• High Noise Immunity
• Machine Insertable, Wave Solderable
Applications
• Programmable Control
• Process Control
• Power Control Panels
• Remote Switching
• Gas Pump Electronics
• Contactors
• Large Relays
• Solenoids
• Motors
• Heaters
Approvals
• UL 508 Recognized Component: File E69938
Description
CPC1998J is an AC Solid State Switch utilizing dual
power SCR outputs. This device also includes
zero-cross turn-on circuitry and is specified with an
800V
P
blocking voltage.
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500V
rms
of isolation between the control and the
output. As a result, the CPC1998 is well suited for
industrial environments where electromagnetic
interference would disrupt the operation of plant facility
communications and control systems.
The unique i4-PAC package pioneered by IXYS allows
Solid State Relays to achieve the highest load current
and power ratings. This package features a unique
IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V
rms
isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Pin Configuration
Parameter Rating Units
AC Operating Voltage 20-240
V
rms
Load Current
With 5°C/W Heat Sink 20
A
rms
No Heat Sink 5
On-State Voltage Drop 1.1
V
P
(at I
L
=2A
P
)
Blocking Voltage 800
V
P
Thermal Resistance,
Junction-to-Case,
JC
0.35 °C/W
Part Description
CPC1998J i4-PAC Package (25 per tube)
2
1
– LED+ LEDAC Load
4
3
ZC
CPC1998
AC Power Switch
I
NTEGRATED
C
IRCUITS
D
IVISION
R05 www.ixysic.com 2
CPC1998
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
1
Derate linearly 1.33mW / °C.
2
Free air, no heat sink.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
1
Tested at a peak value equivalent.
2
Zero-cross first half-cycle @ < 100Hz.
3
Snubber circuits may be required at low power factors.
4
For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use I
F
10mA.
Symbol Min Max Units
Blocking Voltage - 800
V
P
Reverse Input Voltage - 5
V
Input Control Current - 50
mA
Peak (10ms) - 1
A
Input Power Dissipation
1
-150
mW
Total Power Dissipation
2
-3.5
W
I
2
t for Fusing
(1/2 Sine Wave, 60Hz)
-200
A
2
s
Isolation Voltage, Input to Output - 2500 V
rms
ESD, Human Body Model - 8
kV
Operational Temperature - 40 +85 °C
Storage Temperature - 40 +125
°C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current
Continuous
No Heat Sink, V
L
=20-240V
rms
I
L
0.1 - 5
A
rms
Continuous
T
C
=25°C
0.1 - 50
Maximum Surge Current 1/2 Sine Wave, 60Hz I
P
--150A
Off-State Leakage Current
V
L
=800V
I
LEAK
--100
A
P
On-State Voltage Drop
1
I
L
=2A
P
-
-0.851.1
V
P
Off-State dV/dt
I
F
=0mA
dV/dt 1000 - - V/s
Switching Speeds
Tu r n - O n
I
F
=5mA
t
on
--0.5
cycles
Tu r n - O f f t
off
--0.5
Zero-Cross Turn-On Voltage
2
1
st
half-cycle
-
-520
V
subsequent half-cycle
---5
Holding Current - I
H
-4450mA
Latching Current - I
L
-4875mA
Operating Frequency
-
-20-500Hz
Load Power Factor for Guaranteed Turn-On
3
f=60Hz
PF 0.25 - - -
Input Characteristics
Input Control Current to Activate
4
I
L
=1A Resistive, f=60Hz
I
F
--5mA
Input Dropout Voltage -
-0.8- -V
Input Voltage Drop
I
F
=5mA
V
F
0.9 1.2 1.4 V
Reverse Input Current
V
R
=5V
I
R
--10A
Input/Output Characteristics
Capacitance, Input-to-Output -
C
I/O
--3pF
I
NTEGRATED
C
IRCUITS
D
IVISION
3 www.ixysic.com R05
CPC1998
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
2.3 Thermal Performance Data
Parameter Conditions Symbol Rating Units
Thermal Resistance (Junction to Case) -
JC
0.35 °C/W
Thermal Resistance (Junction to Ambient) Free Air
JA
33 °C/W
Junction Temperature (Operating) -
T
J
-40 to +125 °C
θ
CA
=
- θ
JC
(T
J
- T
A
)
P
D
T
J
= Junction Temperature (°C), T
J
≤ 125°C *
T
A
= Ambient Temperature (°C)
θ
JC
= Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θ
CA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D
= On-State Voltage (V
rms
) • Load Current (A
rms
)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
Load Current (A
rms
)
0 5 10 15 20 25 30 35 40
Output Power (W)
0
5
10
15
20
25
30
35
40
Output Power
vs. Load Current
Temperature (ºC)
0 25 50 75 100 125
Output Power (W)
0
5
10
15
20
25
30
35
40
Output Power
vs. Ambient Temperature
Heat Sink
1ºC/W
2ºC/W
5ºC/W
10ºC/W
15ºC/W
Free Air
P1-P3P4-P6P7-P7

CPC1998J

Mfr. #:
Buy CPC1998J
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount SP AC Solid State Power Switch
Lifecycle:
New from this manufacturer.
Delivery:
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