IRL3705NSTRLPBF

IRL3705NSPbF
IRL3705NLPbF
HEXFET
®
Power MOSFET
PD - 95381
l Advanced Process Technology
l Surface Mount (IRL3705NS)
l Low-profile through-hole (IRL3705NL)
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Lead-Free
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRL3705NL) is available for low-
profile applications.
Description
V
DSS
= 55V
R
DS(on)
= 0.01
I
D
= 89A
2
D Pak
TO-262
S
D
G
06/08/04
l
Logic-Level Gate Drive
Parameter Typ. Max. Units
R
θJC
Junction-to-Case  0.90
R
θJA
Junction-to-Ambient ( PCB Mounted,steady-state)** 40
Thermal Resistance
°C/W
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 89
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 63 A
I
DM
Pulsed Drain Current  310
P
D
@T
A
= 25°C Power Dissipation 3.8 W
P
D
@T
C
= 25°C Power Dissipation 170 W
Linear Derating Factor 1.1 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
E
AS
Single Pulse Avalanche Energy 340 mJ
I
AR
Avalanche Current 46 A
E
AR
Repetitive Avalanche Energy 1.7 mJ
dv/dt Peak Diode Recovery dv/dt  5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
IRL3705NS/LPbF
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
 
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
 
p-n junction diode.
V
SD
Diode Forward Voltage   1.3 V T
J
= 25°C, I
S
= 46A, V
GS
= 0V
t
rr
Reverse Recovery Time  94 140 ns T
J
= 25°C, I
F
= 46A
Q
rr
Reverse Recovery Charge  290 440 nC di/dt = 100A/µs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
S
D
G
A
89
310
Pulse width 300µs; duty cycle 2%.
Notes:
Uses IRL3705N data and test conditions
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
I
SD
46A, di/dt 250A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
V
DD
= 25V, starting T
J
= 25°C, L = 320µH
R
G
= 25, I
AS
= 46A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55   V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient  0.056  V/°C Reference to 25°C, I
D
= 1mA
  0.010 V
GS
= 10V, I
D
= 46A
  0.012 V
GS
= 5.0V, I
D
= 46A
  0.018 V
GS
= 4.0V, I
D
= 39A
V
GS(th)
Gate Threshold Voltage 1.0  2.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 50   S V
DS
= 25V, I
D
= 46A
  25 V
DS
= 55V, V
GS
= 0V
  250 V
DS
= 44V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage   100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage   -100 V
GS
= -16V
Q
g
Total Gate Charge   98 I
D
= 46A
Q
gs
Gate-to-Source Charge   19 nC V
DS
= 44V
Q
gd
Gate-to-Drain ("Miller") Charge   49 V
GS
= 5.0V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time  12  V
DD
= 28V
t
r
Rise Time  140  I
D
= 46A
t
d(off)
Turn-Off Delay Time  37 R
G
= 1.8Ω, V
GS
= 5.0V
t
f
Fall Time  78  R
D
= 0.59Ω, See Fig. 10 
Between lead,
 
and center of die contact
C
iss
Input Capacitance  3600  V
GS
= 0V
C
oss
Output Capacitance  870  pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance  320   = 1.0MHz, See Fig. 5
nH
I
GSS
R
DS(on)
Static Drain-to-Source On-Resistance
L
S
Internal Source Inductance 7.5
ns
I
DSS
Drain-to-Source Leakage Current
µA
Calculated continuous current based on maximum allowable
junction temperature; for recommended current-handling of the
package refer to Design Tip # 93-4
IRL3705NS/LPbF
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 3. Typical Transfer Characteristics
1
10
100
1000
0.1 1 10 10
0
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20µs PULSE WIDTH
T = 25°C
J
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
1
10
100
1000
0.1 1 10 10
0
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20µs PULSE WIDTH
T = 175°C
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
J
1
10
100
1000
2.0 3.0 4.0 5.0 6.0 7.0 8.0
T = 25°C
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
T = 175°C
J
A
V = 25V
20µs PULSE WIDTH
DS
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
V = 10V
GS
A
I = 77A
D

IRL3705NSTRLPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 55V 89A 10mOhm 65.3nC LogLvl
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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