Data Sheet ADL5322
Figure 16 shows how ACP varies with output power level. The
close-in ACP is a function of the signal coding and is unaffected
by output headroom at these power levels. The ACP measured
at 1.98 MHz carrier offset is −72 dBc at 10 dBm output power
(12 dB below the required 60 dBc). At 4 MHz carrier offset, the
noise and distortion measured in a 1 MHz bandwidth is −75 dBm
at 6 dBm (total) output power (0 dBm per carrier). In a 50 dBm
transmitter, this corresponds to an antenna-referred output
power of −31 dBm (1 MHz), which is 18 dB below what is
required by the CDMA2000 standard.
Figure 16. CDMA2000 ACP vs. Output Power per Carrier; 4 Adjacent Carriers
–30
–100
–10
OUTPUT POWER (dBm)
ACP1 AND ACP2 – 30kHz RBW (dBc)
ACP3 – 1MHz RBW (dBm)
10
–50
–40
–60
–70
–80
–90
–30
–100
–50
–40
–60
–70
–80
–90
–8 –6 –4 –2 0 2
4 6 8
ACP1 (dBc) – 750kHz OFFSET – 30kHz RBW
ACP3 (dBm) – 4MHz OFFSET – 1MHz RBW
ACP2 (dBc) – 1.98MHz OFFSET – 30kHz RBW
06057-015
Rev. A | Page 9 of 12
ADL5322 Data Sheet
EVALUATION BOARD
Figure 18 shows the schematic of the ADL5322 evaluation
board. The board is powered by a single supply in the 4.75 V to
5.25 V range. The power supply is decoupled on each of the
three power supply pins by 10 µF, 10 nF, and 100 pF capacitors.
See Table 5 for exact evaluation board component values. Note
that all three VCC pins (Pin 1, Pin 2, and Pin 5) should be
independently bypassed as shown in Figure 18 for proper
operation.
Figure 17. Evaluation Board Component Side View
Table 5. Evaluation Board Components
Component Function Default Value
DUT1 Driver amplifier ADL5322
C1, C12, C16 Low frequency bypass capacitors 10 µF, 0603
C3, C11, C17 Low frequency bypass capacitors 10 nF, 0402
C2, C10, C18
High frequency bypass capacitors
100 pF, 0402
C8, C9, C13, C14, R3 Open Open, 0402
R2, R4 AC coupling capacitors 100 pF, 0402
Figure 18. Evaluation Board Schematic
06057-016
AGNDAGNDAGND
AGND
AGND
AGND
VCC
RFIN
RFOUT
ADL5322/
ADL5323
VCC
VCC
GND
GND
RFIN VCC
GND
RFOUT
R2
100pF
DUT1
VCCVCC
VCC
GND
8
7
6
5
1
2
3
4
AGND
C2
100pF
C1
10µF
C3
10nF
AGNDAGND
C8
OPEN
C9
OPEN
R4
100pF
VCC
TP2
VCC
SNS1
AGNDAGNDAGND
C16
10µF
C18
100pF
TP1
C17
10nF
AGNDAGNDAGND
C12
10µF
C10
100pF
C11
10nF
AGNDAGND
C13
OPEN
C14
OPEN
R3
OPEN
W1
06057-017
Rev. A | Page 10 of 12
Data Sheet ADL5322
OUTLINE DIMENSIONS
Figure 19. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding Ordering Quantity
ADL5322ACPZ-R7 −40°C to +85°C 8-Lead LFCSP_VD, 7" Tape and Reel CP-8-2 OP 1500
ADL5322ACPZ-WP −40°C to +85°C 8-Lead LFCSP_VD, Waffle Pack CP-8-2 OP 50
ADL5322-EVALZ Evaluation Board 1
1
Z = RoHS Compliant Part.
1
EXPOSED
PAD
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-04-2012-
A
Rev. A | Page 11 of 12

ADL5322-EVALZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
ADL5322 RF Amplifier Evaluation Board
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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