NDS356P

NDS356P Rev. E1
-3-2.5-2-1.5-1-0.50
-5
-4
-3
-2
-1
0
V , DRAIN-SOURCE VOLTAGE (V)
I , DRAIN-SOURCE CURRENT (A)
-6.0
-5.0
-4.5
-3.0
V = -10V
GS
DS
D
-4.0
-3.5
-5-4-3-2-10
0.5
0.75
1
1.25
1.5
1.75
2
I , DRAIN CURRENT (A)
DRAIN-SOURCE ON-RESISTANCE
V = -3.5 V
GS
D
R , NORMALIZED
DS(on)
-4.0
-6.0
-10
-5.0
-4.5
Figure 1. On-Region Characteristics Figure 2. On-Resistance Variation
with Drain Current and Gate Voltage
Typical Electrical Characteristics
-6-5-4-3-2-10
0.5
1
1.5
2
2.5
3
3.5
I , DRAIN CURRENT (A)
DRAIN-SOURCE ON-RESISTANCE
T = 125°C
J
25°C
-55°C
D
V = 4.5V
GS
R , NORMALIZED
DS(on)
Figure 3. On-Resistance Variation
with Temperature
Figure 4. On-Resistance Variation
with Drain Current and Temperature
-8-6-4-20
-10
-8
-6
-4
-2
0
V , GATE TO SOURCE VOLTAGE (V)
I , DRAIN CURRENT (A)
25
125
V = 10V
DS
GS
D
T = -55°C
J
-50 -25 0 25 50 75 100 125 150
0.8
0.85
0.9
0.95
1
1.05
1.1
1.15
T , JUNCTION TEMPERATURE (°C)
GATE-SOURCE THRESHOLD VOLTAGE (V)
J
I = -250µA
D
V = V
DS GS
V , NORMALIZED
th
Figure 5. Transfer Characteristics
Figure 6. Gate Threshold Variation
with Temperature
-50 -25 0 25 50 75 100 125 150
0.8
0.9
1
1.1
1.2
1.3
T , JUNCTION TEMPERATURE (°C)
DRAIN-SOURCE ON-RESISTANCE
J
V = -4.5 V
GS
I = -1.1 A
D
R , NORMALIZED
DS(ON)
NDS356P Rev. E1
-50 -25 0 25 50 75 100 125 150
0.96
0.98
1
1.02
1.04
1.06
1.08
T , JUNCTION TEMPERATURE (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE (V)
I = -250µA
D
BV , NORMALIZED
DSS
J
-1.8-1.5-1.2-0.9-0.6-0.3
0.001
0.01
0.1
0.2
0.5
1
2
10
V , BODY DIODE FORWARD VOLTAGE (V)
-I , REVERSE DRAIN CURRENT (A)
25°C
-55°C
T = 125°C
J
V = 0V
GS
SD
S
Figure 7. Breakdown Voltage Variation with
Temperature
Figure 8. Body Diode Forward Voltage Variation with
Source Current and Temperature
Typical Electrical Characteristics (continued)
0 1 2 3 4 5 6 7
-10
-8
-6
-4
-2
0
Q , GATE CHARGE (nC)
V , GATE-SOURCE VOLTAGE (V)
I = -1.1 A
D
g
GS
V = -5 V
DS
-10
0.1 0.2 0.5 1 2 5 10 20
30
50
100
200
300
500
700
-V , DRAIN TO SOURCE VOLTAGE (V)
CAPACITANCE (pF)
DS
C
iss
f = 1 MHz
V = 0 V
GS
C
oss
C
rss
G
D
S
V
DD
R
L
V
V
IN
OUT
V
GS
DUT
R
GEN
10%
50%
90%
10%
90%
90%
50%
V
IN
V
OUT
on off
d(off)
f
r
d(on)
t t
t
tt
t
INVERTED
10%
PULSE WIDTH
Figure 9. Capacitance Characteristics
Figure 10. Gate Charge Characteristics
Figure 11. Switching Test Circuit
Figure 12. Switching Waveforms
NDS356P Rev. E1
-10-8-6-4-20
0
1
2
3
4
5
I , DRAIN CURRENT (A)
g , TRANSCONDUCTANCE (SIEMENS)
T = -55°C
J
25°C
D
FS
V = -5V
DS
125°C
0.1 0.2 0.5 1 2 5 10 20 30
0.01
0.02
0.05
0.1
0.2
1
5
10
20
- V , DRAIN-SOURCE VOLTAGE (V)
- I , DRAIN-SOURCE CURRENT (A)
DS
D
V = -10V
SINGLE PULSE
T = 25°C
GS
A
DC
RDS(ON) LIMIT
1s
100ms
10s
10ms
1ms
100us
Figure 13. Transconductance Variation with
Drain Current and Temperature
Figure 14. Maximum Safe Operating Area
Typical Electrical Characteristics (continued)
0.0001 0.001 0.01 0.1 1 10 100 300
0.001
0.002
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
t , TIME (sec)
TRANSIENT THERMAL RESISTANCE
r(t), NORMALIZED EFFECTIVE
1
Single Pulse
D = 0.5
0.1
0.05
0.02
0.01
0.2
Duty Cycle, D = t /t
1 2
R (t) = r(t) * R
R = 250 °C/W
θ
JA
θ
JA
θ
JA
T - T = P * R (t)
θ
JA
A
J
P(pk)
t
1
t
2
Figure 15. Transient Thermal Response Curve
Note : Characterization performed using the conditions described in note 1c. Transient thermal response will
change depending on the circuit board design.

NDS356P

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET P-CH 20V 1.1A SSOT-3
Lifecycle:
New from this manufacturer.
Delivery:
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