© 2007 Microchip Technology Inc. DS21948D-page 19
MCP3905/06
24-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
N
otes:
. Pin 1 visual index feature may vary, but must be located within the hatched area.
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 24
Pitch e 0.65 BSC
Overall Height A – – 2.00
Molded Package Thickness A2 1.65 1.75 1.85
Standoff A1 0.05 – –
Overall Width E 7.40 7.80 8.20
Molded Package Width E1 5.00 5.30 5.60
Overall Length D 7.90 8.20 8.50
Foot Length L 0.55 0.75 0.95
Footprint L1 1.25 REF
Lead Thickness c 0.09 – 0.25
Foot Angle φ 0° 4° 8°
Lead Width b 0.22 – 0.38
D
E
E1
N
12
b
e
NOTE 1
c
A
A1
L1
L
A2
φ
Microchip Technology Drawing C04-132
