STPS30SM80CFP

Characteristics STPS30SM80C
4/11 Doc ID 018727 Rev 1
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
0
20
40
60
80
100
120
140
160
180
1.E-03 1.E-02 1.E-01 1.E+00
TO-220AB / I PAK / D PAK
22
I
M
t
δ = 0.5
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
I (A)
M
t(s)
0
10
20
30
40
50
60
70
80
90
100
110
1.E-03 1.E-02 1.E-01 1.E+00
TO-220FPAB
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
I
M
t
δ = 0.5
I (A)
M
t(s)
Figure 8. Relative thermal impedance
junction to case versus pulse
duration
Figure 9. Relative thermal impedance
junction to case versus pulse
duration (TO-220FPAB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
TO-220AB / I PAK / D PAK
22
Z/R
th(j-c) th(j-c)
t (s)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
Z/R
th(j-c) th(j-c)
t (s)
p
TO-220FPAB
Figure 10. Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
Figure 11. Junction capacitance versus
reverse voltage applied
(typical values, per diode)
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
0 1020304050607080
I (µA)
R
V (V)
R
T = 25 °C
j
T = 50 °C
j
T = 75 °C
j
T = 125 °C
j
T = 150 °C
j
T = 100 °C
j
100
1000
1 10 100
F = 1 MHz
V = 30 mV
T = 25 °C
osc RMS
j
C(pF)
V (V)
R
STPS30SM80C Characteristics
Doc ID 018727 Rev 1 5/11
Figure 14. Thermal resistance junction to ambient versus copper surface under tab for D
2
PAK
Figure 12. Forward voltage drop versus
forward current (per diode)
Figure 13. Reverse safe operating area
(t
p
< 1 µs and T
j
< 150 °C)
0
5
10
15
20
25
30
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
(Typical values)
T = 125 °C
j
(Maximum values)
T = 125 °C
j
(Maximum values)
T = 25 °C
j
I (A)
FM
V (V)
FM
15.0
16.0
17.0
18.0
19.0
20.0
21.0
22.0
23.0
100 105 110 115 120 125 130 135 140 145 150
V (V)
arm
I (A)
arm
I (V ) 150 °C, 1µs
arm arm
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
DPAK
2
R (°C/W)
th(j-a)
S (cm )
Cu
2
epoxy printed board copper thickness = 35 µm
Package information STPS30SM80C
6/11 Doc ID 018727 Rev 1
2 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 5. TO-220AB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 Typ. 0.645 Typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 Typ. 0.102 Typ.
Dia. 3.75 3.85 0.147 0.151
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2
F2
F1
E
M

STPS30SM80CFP

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers Dual 2000V Schottky 80V 45pF 0.490V Vf
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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