APTGT150A120G

APTGT150A120G
APTGT150A120G – Rev 2 October, 2012
www.microsemi.com
1-6
Absolute maximum ratings
Symbol Parameter Max ratings Unit
V
CES
Collector - Emitter Breakdown Voltage 1200 V
T
C
= 25°C
220
I
C
Continuous Collector Current
T
C
= 80°C
150
I
CM
Pulsed Collector Current T
C
= 25°C 350
A
V
GE
Gate – Emitter Voltage ±20 V
P
D
Maximum Power Dissipation
T
C
= 25°C
690 W
RBSOA Reverse Bias Safe Operating Area T
j
= 125°C 300A @ 1150V
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Q2
0/VBUS
Q1
VBUS
OUT
G1
G2
E2
E1
V
CES
= 1200V
I
C
= 150A @ Tc = 80°C
Application
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Features
Fast Trench + Field Stop IGBT3
Technology
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
Benefits
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Phase leg
Fast Trench + Field Stop IGBT3
P
ower Module
APTGT150A120G
APTGT150A120G – Rev 2 October, 2012
www.microsemi.com
2-6
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
I
CES
Zero Gate Voltage Collector Current V
GE
= 0V, V
CE
= 1200V 350 µA
T
j
= 25°C 1.7 2.1
V
CE(sat)
Collector Emitter Saturation Voltage
V
GE
= 15V
I
C
= 150A
T
j
= 125°C 2.0
V
V
GE(th)
Gate Threshold Voltage V
GE
= V
CE
, I
C
= 3 mA 5.0 5.8 6.5 V
I
GES
Gate – Emitter Leakage Current V
GE
= 20V, V
CE
= 0V 400 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
ies
Input Capacitance 10.7
C
oes
Output Capacitance 0.56
C
res
Reverse Transfer Capacitance
V
GE
= 0V
V
CE
= 25V
f = 1MHz
0.48
nF
T
d(on)
Turn-on Delay Time 280
T
r
Rise Time 40
T
d(off)
Turn-off Delay Time 420
T
f
Fall Time
Inductive Switching (25°C)
V
GE
= ±15V
V
Bus
= 600V
I
C
= 150A
R
G
= 2.2
75
ns
T
d(on)
Turn-on Delay Time 290
T
r
Rise Time 45
T
d(off)
Turn-off Delay Time 520
T
f
Fall Time
Inductive Switching (125°C)
V
GE
= ±15V
V
Bus
= 600V
I
C
= 150A
R
G
= 2.2
90
ns
E
on
Turn-on Switching Energy T
j
= 125°C 14
E
off
Turn-off Switching Energy
V
GE
= ±15V
V
Bus
= 600V
I
C
= 150A
R
G
= 2.2
T
j
= 125°C 16
mJ
Reverse diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
RRM
Maximum Peak Repetitive Reverse Voltage
1200 V
T
j
= 25°C 250
I
RM
Maximum Reverse Leakage Current V
R
=1200V
T
j
= 125°C 600
µA
I
F
DC Forward Current
Tc = 80°C 150 A
T
j
= 25°C 1.6 2.1
V
F
Diode Forward Voltage I
F
= 150A
T
j
= 125°C 1.6
V
T
j
= 25°C 170
t
rr
Reverse Recovery Time
T
j
= 125°C 280
ns
T
j
= 25°C 14
Q
rr
Reverse Recovery Charge
T
j
= 125°C 28
µC
T
j
= 25°C 6
E
r
Reverse Recovery Energy
I
F
= 150A
V
R
= 600V
di/dt =2500A/µs
T
j
= 125°C 11
mJ
APTGT150A120G
APTGT150A120G – Rev 2 October, 2012
www.microsemi.com
3-6
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
IGBT
0.18
R
thJC
Junction to Case Thermal Resistance
Diode 0.32
°C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
4000 V
T
J
Operating junction temperature range -40 150
T
STG
Storage Temperature Range -40 125
T
C
Operating Case Temperature -40 100
°C
To heatsink M6 3 5
Torque Mounting torque
For terminals M5 2 3.5
N.m
Wt Package Weight 300 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

APTGT150A120G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
IGBT Modules DOR CC6111
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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