LB Y87S-M1N2-35-Z

LB Y87S
2002-10-18 13
Empfohlenes Lötpaddesign IR Reflow Löten
Recommended Solder Pad IR Reflow Soldering
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat
Gurtung / Polarität und Lage Verpackungseinheit 3000/Rolle, ø180 mm oder
10000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 3000/reel, ø180 mm
or 10000/reel, ø330 mm
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHPY1315
0.8 (0.031)
2.2 (0.087)
0.7 (0.028)
Component location on pad
Bauteil positioniert
Padgeometrie für
CA
verbesserte Wärmeableitung
heat dissipation
Paddesign for improved
Lötstopplack
Solder resist
C
A
OHAY1515
1.5 (0.059)
4 (0.157)
2 (0.079)
3.5 (0.138)
1.75 (0.069)
8.1 (0.319)
A
C
0.9 (0.035)
2.4 (0.094)
3.3 (0.130)
1.25 (0.049)
0.3 (0.012) max.
1.4 (0.055)
2002-10-18 14
LB Y87S
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but dont represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2002-10-18 Date of change
Previous Version: -
Page Subjects (major changes since last revision)

LB Y87S-M1N2-35-Z

Mfr. #:
Manufacturer:
Description:
LED BLUE CLEAR SMD R/A
Lifecycle:
New from this manufacturer.
Delivery:
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