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TNP10 Series
Thin Film TO-126 Resistor
Ohmite offers a high power heatsinkable TO-126 packaged
resistor. They can achieve 1W in free air and 10W when
attached to a proper heatsink. The non-inductive design is ideal
for high speed circuits. These models exhibit low noise, high
frequency operation and high density installation. Applications
include: Constant current sources, electronic load circuits, LSI
tests, measurement, audio PA systems and motor control.
Derating
Coonstruction
Temperature Rise
CHARACTERISTICS
SPECIFICATIONS
(continued)
Rating Power* (W)
Flange Temp. (°C)
8
4
2
0
-55° 0° 50°
25°
100° 155° 200°
10
6
*with 2.8K/W heatsink
Temperature Rise (°C)
Applied Power (W)
90
30
0
0 2.5 5 7.5 10
120
60
Leads (tin plated Cu)
Molding (epoxy UL94-VO)
Conductor (Cu)
Resistor (Ni-Cr or RuO)
Substrate (alumina)
Flange (Ni plated Cu)
Resistance Range
Values listed below; others on request
Temp. Range
-55°C to +155°C
Rated Temperature
+25°C
Rated Power
10W (-55 to 25°C flange temperature),
1W free air
Item Performance Condition
Dielectric
Withstanding
Voltage
2000VAC 60 sec., between termi-
nals and flange
Insulation
Resistance
Over 1000MΩ Between terminals and
flange
Moisture
Resistance
±(1.0%+0.05Ω) 60°C, 90 to 95%RH, DC
0.1W, 1000 hrs.
Load Life
±(1.0%+0.05Ω) 25°C, 90min. ON, 30min.
OFF, 1000hrs
Soldering Heat
±(1.0%+0.05Ω) 350 ±5°C, 3 sec.
Solderability
Over 95% of surface 230 ±5°C, 3 sec.
Vibration
±0.25% IEC 60068-2-6
Resistance TCR Heat
Series Wattage* Range (Ω) Tolerance (ppm/°C) Resistance**
0.09-0.1 5% (J) ±250
TNP10S 10W 0.1-9.1 ±1% (F), 5% (J) ±100 5.9°C/W
10-51K ±1% (F) ±50
* Flange temp. -55° - 25°C; 1W at free air **From hot spot to flange
THIS PRODUCT IS DESIGNED
FOR USE WITH PROPER
HEATSINKING.
Maximum base plate temperature of the resistor
must be monitored and kept within speci-
fied limits to establish the power rating. Best
technique is to attach a thermocouple to the side
of the base plate of the resistor. Temperature of
plastic housing or heat sink cannot be used to
establish rating of the resistor.