SMTY12A Datasheet SMTY12A, SMTY5.0A | P1-P3

April 2006 Rev 1 1/7

7

SMTYxxA

Low forward voltage TVS: Transky™

Main applications

■ Power rail ESD transient over-voltages and

reverse voltages protection for 5 and 12 V

supplied IC’s

Description

The Transky is designed specifically for

miniaturized electronic devices and equipment

subject to ESD transient over-voltages. The

Transky combines the performance of a Transil™

or TVS (Transient Voltage Suppressor) and low

forward voltage Schottky diode in a monolithic

structure.

It offers both an overshoot protection in the 6.4 V

or 13.2 V clamping ranges and a negative spike

protection in the -0.48 V clamping range

compared to the -1 V with the standard Transil

family on the 5 or 12 V power line.

Its 600 W power capability offers high transient

capability with SMA package.

Features

■ Integration of a Transil with a Schottky diode

■ JEDEC registred SMA package outline

■ Low clamping factor V

CL

/V

BR

■ Fast response time

■ RoHS compliant

Benefits

■ Optimized PCB area: up to 62% space saving

versus discrete solution

■ High peak pulse power: up to 600 W

■ Stand-off voltage:

5 V for SMTY5.0A

12 V for SMTY12A

■ Low forward voltage: 0.48 V @ 1 A

■ Very low leakage current:

10 µA @ 5 V for SMTY5.0A

20 µA @12 V for SMTY12A

Order code

Complies with following standard

Part number Marking

SMTY5.0A Y5.0

SMTY12A Y12

IEC 61000-4-2 Level 4

Air discharge 15 kV

Contact discharge 8 kV

K

A

SMA

(JEDEC DO-214AC)

K

A

K

A

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Obsolete Product(s) - Obsolete Product(s)

Characteristics SMTYxxA

2/7

1 Characteristics

Table 1. Absolute ratings (limiting value)

Symbol Parameter Value Unit

V

pp

IEC 61000-4-2 level 4 standard

Air discharge

Contact discharge

15

8

kV

P Power dissipation on infinite heatsink T

amb

= 25° C 4 W

P

PP

Peak pulse Power dissipation

(1)

1. 10/1000µs pulse waveform

T

j initial

= T

amb

600 W

I

FSM

Non repetitive surge peak forward current

t

p

=10 ms

T

j initial

= T

amb

40 A

T

stg

Storage temperature range -65 to +175 °C

T

j

Maximum operating junction temperature

(2)

2. thermal runaway condition for a Transky

150 °C

Table 2. Thermal resistance

Symbol Parameter Value Unit

R

th(j-a)

Junction to ambient on printed circuit 120 °C/W

R

th(j-l)

Junction to lead 30 °C/W

Table 3. Electrical characteristics

Symbol Parameter

I

RM

Leakage current @ V

RM

V

RM

Stand-off voltage

V

BR

Breakdown voltage

I

R

Reverse leakage current

V

CL

Clamping voltage

I

PP

Peak pulse current

V

F

Forward voltage drop

I

RM

max

@ V

RM

I

RM max

@

V

RM

@ 85° C

V

BR min

@ I

R

V

CL

max @ I

PP

10/1000 µs

V

F

max

@ 1A

(1)

1. Pulse test t

p

= 500 µs, δ < 2%

αT max

µA V mA V V mA V A V 10

-4

/°C

SMTY5.0A 10 5 0.5 5 6.4 10 9 43.5 0.48 10

SMTY12A 20 12 1.2 12 13.2 1 18.5 31 0.48 10

d

Ptot

dTj

-

--------------

1

Rth j a–()

--------------------------

<

V

CL

V

BR

V

RM

I

RM

I

R

I

PP

V

I

F

V

F

V

CL

V

BR

V

RM

I

RM

I

R

I

PP

V

I

F

V

F

Obsolete Product(s) - Obsolete Product(s)

SMTYxxA Characteristics

3/7

Figure 1. Pulse waveform (10/1000 µs) Figure 2. Peak pulse power versus

exponential pulse duration

(T

j

initial = 25° C)

Pulse waveform 10/1000 µs

t

p

= 10 µs

1000 µs

I

1.E-01

1.E+00

1.E+01

0.01 0.10 1.00 10.00

P

pp

(kW)

T

j

initial = 25 °C

t

p

(ms)

Figure 3. Relative variation of peak pulse

power versus initial junction

temperature

Figure 4. Average power dissipation versus

ambient temperature

0

10

20

30

40

50

60

70

80

90

100

110

0 25 50 75 100 125 150 175

%

T

j

(°C)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

0 25 50 75 100 125 150

P(W)

R

th(j-a)

=R

th(j-l)

R

th(j-a)

=120 °C/W

(PCB FR4, recommended pad layout)

T

amb

(°C)

Figure 5. Variation of thermal impedance,

junction to ambient, versus pulse

duration (Epoxy, FR4, e

Cu

= 35 µm)

Figure 6. Thermal resistance, junction to

ambient, versus copper surface

under each lead (printed circuit

board FR4, e

Cu

= 35 µm)

0.1

1.0

10.0

100.0

1000.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Z

th(j-a)

(°

C/

W)

S

CU

=3 mm²

Recommended pad layout

t

p

(s)

0

20

40

60

80

100

120

140

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

R

th(j-a)

(°C/W)

S

CU

(cm²)

SMTY12A

SMTY12A

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