HMC434 Data Sheet
Rev. E | Page 4 of 9
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage (V
) −0.3 V to +3.5 V
RF Input Power (V
CC
= 3 V)
Temperature
Operating −40°C to +85°C
Storage −65°C to +125°C
Junction, T
135°C
Nominal (T
= 85°C) 99°C
Reflow 260°C
ESD Sensitivity
Human Body Model (HBM) Class 0
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
θ
Unit
RJ-6 359 70 °C/W
1
Simulated values per JEDEC JESD51-12 standards.
2
Junction to GND package pin.
ESD CAUTION