Spec No. JELF243A-0031S-01 P.3/8
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.4 Solderability The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance : No damage
Inductance Change : within ± 5 %
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance
(It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat
Resistance
Appearance: No damage
Inductance Change: within ± 5 %
DC Resistance Change: within ± 5 %
Temperature: 85 °C ± 2 °C
Time: 1000h (+ 48h , - 0h)
Then measured after exposure in the room
condition for 24±2 hours.
8.2 Cold
Resistance
Temperature: - 40 °C ± 2 °C
Time: 1000h (+ 48h , - 0h)
Then measured after exposure in the room
condition for 24±2 hours.
8.3 Humidity Temperature: 40 °C ± 2 °C
Humidity: 90 %(RH) to 95 %(RH)
Time: 1000h (+ 48h , - 0h)
Then measured after exposure in the room
condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle :
1 step : - 40 °C ± 2 °C / 30 min ± 3 min
2 step : Ordinary temp. / 10 min to 15 min
3 step : + 85 °C ± 2 °C / 30 min ± 3 min
4 step : Ordinary temp. / 10 min to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is
measured at the bottom side.
4.0±0.1
3.5±0.05
3.6±0.1
8.0±0.2
+0.1
φ
1.5
2.0±0.051.9±0.1
2.0±0.1
0.2
1.75±0.1
4.0±0.1
-0
Direction of feed
(in mm)
※
Lead- in / out wire
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
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