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MC74ACT373DWR2G

P1-P3P4-P6P7-P9P10-P10
MC74AC373, MC74ACT373
www.onsemi.com
7
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol Parameter
V
CC
*
(V)
74ACT 74ACT
Unit
Fig.
No.
T
A
= +25°C
C
L
= 50 pF
T
A
= −40°C
to +85°C
C
L
= 50 pF
Min Typ Max Min Max
t
PLH
Propagation Delay
D
n
to O
n
5.0 2.5 8.5 10 1.5 11.5 ns 3−5
t
PHL
Propagation Delay
D
n
to O
n
5.0 2.0 8.0 10 1.5 11.5 ns 3−5
t
PLH
Propagation Delay
LE to O
n
5.0 2.5 8.5 11 2.0 11.5 ns 3−6
t
PHL
Propagation Delay
LE to O
n
5.0 2.0 8.0 10 1.5 11.5 ns 3−6
t
PZH
Output Enable Time 5.0 2.0 8.0 9.5 1.5 10.5 ns 3−7
t
PZL
Output Enable Time 5.0 2.0 7.5 9.0 1.5 10.5 ns 3−8
t
PHZ
Output Disable Time 5.0 2.5 9.0 11 2.5 12.5 ns 3−7
t
PLZ
Output Disable Time 5.0 1.5 7.5 8.5 1.0 10 ns 3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
AC OPERATING REQUIREMENTS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol
Parameter
V
CC
*
(V)
74ACT 74ACT
Unit
Fig.
No.
T
A
= +25°C
C
L
= 50 pF
T
A
= −40°C
to +85°C
C
L
= 50 pF
Typ Guaranteed Minimum
t
s
Setup Time, HIGH or LOW
D
n
to LE
5.0 3.0 7.0 8.0 ns 3−9
t
h
Hold Time, HIGH or LOW
D
n
to LE
5.0 0 0 1.0 ns 3−9
t
w
LE Pulse Width, HIGH 5.0 2.0 7.0 8.0 ns 3−6
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter
Value
Typ
Unit Test Conditions
C
IN
Input Capacitance 4.5 pF V
CC
= 5.0 V
C
PD
Power Dissipation Capacitance 40 pF V
CC
= 5.0 V
MC74AC373, MC74ACT373
www.onsemi.com
8
ORDERING INFORMATION
Device Package Shipping
†
MC74AC373DWG SOIC−20
(Pb−Free)
38 Units / Rail
MC74AC373DWR2G SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74ACT373DWG SOIC−20
(Pb−Free)
38 Units / Rail
MC74ACT373DWR2G SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74AC373DTG TSSOP−20
(Pb−Free)
75 Units / Rail
MC74AC373DTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
MC74ACT373DTG TSSOP−20
(Pb−Free)
75 Units / Rail
MC74ACT373DTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
SOIC−20W TSSOP−20
1
20
AC
373
ALYWG
G
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
1
20
ACT
373
ALYWG
G
20
1
ACT373
AWLYYWWG
20
1
AC373
AWLYYWWG
MC74AC373, MC74ACT373
www.onsemi.com
9
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E
ISSUE D
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
P1-P3P4-P6P7-P9P10-P10

MC74ACT373DWR2G

Mfr. #:
Buy MC74ACT373DWR2G
Manufacturer:
ON Semiconductor
Description:
Latches 5V Octal Transparent w/3 State Outupts
Lifecycle:
New from this manufacturer.
Delivery:
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