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NCP383LMUAJAATXG

P1-P3P4-P6P7-P9P10-P10
NCP383
http://onsemi.com
4
MAXIMUM RATINGS
Rating Symbol Value Unit
From IN to OUT1, From IN to OUT2 Supply Voltage
(Note 1)
V
IN
,
V
OUT1
,V
OUT2
−7.0 to +7.0 V
IN, OUT1,OUT2, /EN1, /EN2, /FLAG1, /FLAG2, ILIM
Pins: In/Output (Note 1)
V
IN
,
V
OUT1,
V
OUT2,
V
EN1
,
V
EN2
,
V
FLAG1
,V
FLAG2,
V
ILIM,
−0.3 to +7.0 V
/FLAG1, /FLAG2 Sink Current I
SINK
2 mA
ESD Withstand Voltage (IEC 61000−4−2) (output only,
when bypassed with 1.0 mF capacitor minimum)
ESD IEC 15 Air, 8 contact kV
Human Body Model (HBM) ESD Rating are (Note 2) ESD HBM 2000 V
Machine Model (MM) ESD Rating are (Note 2) ESD MM 200 V
Latch−up protection (All Pins) (Note 3) LU 100 mA
Maximum Junction Temperature (Note 4) T
J
−40 to + TSD °C
Storage Temperature Range T
STG
−40 to + 150 °C
Moisture Sensitivity (Note 5) MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
3. Latch up Current Maximum Rating: +100 mA per JEDEC standard: JESD78 class II.
4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020
OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
Operational Power Supply 2.7 5.5 V
V
ENX
Enable Voltage 0 5.5
T
A
Ambient Temperature Range −40 25 +85 °C
I
SINK
/FLAG sink current 1 mA
C
IN
Decoupling input capacitor 1
mF
C
OUTX
Decoupling output capacitor USB port per Hub 120
mF
R
q
JA
Thermal Resistance Junction to Air DFN−10−12 package (Notes 6 and 7) 85 °C/W
T
J
Junction Temperature Range −40 25 +125 °C
I
OUTX
Recommended Maximum DC current Per Channel 2.5 A
P
D
Power Dissipation Rating (Note 8)
T
A
≤ 25 °C DFN−10 package 850
mW
T
A
= 85 °C DFN−10 package 428
6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020
7. The R
q
JA
is dependent of the PCB heat dissipation. Announced thermal resistance is the unless PCB dissipation and can be improve with
final PCB layout.
8. The maximum power dissipation (P
D
) is given by the following formula:
P
D
+
T
JMAX
* T
A
R
qJA
NCP383
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5
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for T
A
between −40°C to +85°C and T
J
up to + 125°C for V
IN
between
2.5 V to 5.5 V (Unless otherwise noted). Typical values are referenced to T
A
= + 25°C and V
IN
= 5 V.
Symbol Parameter Conditions Conditions Min Typ Max Unit
POWER SWITCH
R
DS(on)
Static drain−source on−state
resistance, per channel
T
J
= 25°C 45 70
mW
–40°C < T
J
< 125°C 95
T
R
Output rise time V
IN
= 5 V
C
LOAD
= 1mF,
R
LOAD
= 100 W
(Note 9)
1.5 2.5 4
ms
T
F
Output fall time V
IN
= 5 V 0.1 0.5
Logic Pins
V
IHEN
High−level input voltage 1.2 V
V
ILEN
Low−level input voltage
0.4
V
I
ENx
Input current V
ENx
= 0 V, V
/ENx
= 5 V −0.5 0.5
mA
T
ON
Turn on time
C
LOAD
= 1mF, R
LOAD
= 100 W (Note 9)
1 − 9 ms
T
OFF
Turn off time 1 3 ms
CURRENT LIMIT
I
OCP
Current−limit threshold (Max-
imum DC output current
I
OUTX
delivered to load)
Ilimx = 90k (Note 10) 0.5 0.6 0.7
A
Ilimx = 56k 0.9 1 1.1
Ilimx = 20k (Note 10) 2.58 2.8
3.01
T
DET
Response time to short circuit V
IN
= 5 V (Note 10) 2
ms
T
REG
Regulation time 1 2 3 ms
T
OCP
Over current protection time 19 24 29 ms
UNDERVOLTAGE LOCKOUT
V
UVLO
IN pin low−level input voltage V
IN
rising − 2.45 2.5 V
V
HYST
IN pin hysteresis T
J
= 25°C 25 mV
T
RUVLO
Re−arming Time 7 12 15 ms
SUPPLY CURRENT
I
INOFF
Low−level output supply cur-
rent.
V
IN
= 5 V, No load on OUTX, Device OFF
V
ENX
= 0 V or V
/ENX
= 5 V – T
J
= 25°C
1
mA
I
INON
High−level output supply cur-
rent.
V
IN
= 5 V, No load on OUTX
Device ON − R
ILIM
= 56 kW − V
ENX
= 5 V
99
mA
I
REV
Reverse leakage current
V
OUTX
= 5 V,
V
IN
= 0 V
T
J
= 25°C 1
mA
/FLAGx PINS
V
OL
/FLAGX output low voltage I
/FLAGX
= 1 mA 400 mV
I
LEAK
Off−state leakage V
/FLAGX
= 5 V 1
mA
T
FGL
/FLAGX deglitch /FLAGX de−assertion time due to overcurrent 3 5 7 ms
T
FOCP
/FLAGX deglitch /FLAGX assertion due to overcurrent 5 7 12 ms
T
FREV
/FLAGX deglitch /FLAGX assertion due to reverse−voltage 3 5 7 ms
REVERSE VOLTAGE PROTECTION
V
REV
Reverse voltage threshold V
OUT
− V
IN
drop 150 mV
V
RHYST
Reverse voltage threshold
hysteresis
V
OUT
− V
IN
drop decrease 30 mV
THERMAL SHUTDOWN
T
SD
Thermal shutdown threshold 140 °C
T
SDOCP
Thermal regulation threshold 125 °C
T
RST
Thermal regulation rearming
threshold
115 °C
9. Parameters are guaranteed for CLOAD and RLOAD connected to the OUT pin with respect to the ground.
10.Guaranteed by design and by characterization
NCP383
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6
TON
TOFF
50%
90%
10%
VEN
VOUT
90%
10%
VOUT
10%
TR TF
Figure 3. Ton, Toff, Trise, and Tfall
FUNCTIONAL DESCRIPTION
Overview
The NCP383 is a dual high side N channel MOSFET
power distribution switches designed to protect the input
supply voltage in case of heavy capacitive loads, short
circuit or over current. In addition, the high side MOSFETs
are turned off during under voltage, thermal shutdown or
reverse voltage condition. Thanks to the soft start circuitry,
NCP383 is able to limit large current and voltage surges.
Overcurrent Protection
NCP383 switches into a constant current regulation mode
when the output current is above the I
OCP
threshold.
Depending on the load, the output voltage is decreased
accordingly.
− In case of hot plug with heavy capacitive load, the
output voltage is brought down to the capacitor voltage.
The NCP383 will limit the current to the I
OCP
threshold
value until the charge of the capacitor is completed.
VOUTX
IOCP
IOUTX
Drop due to
capacitor charge
Figure 4. Heavy Capacitive Load
− In case of overload, the current is limited to the I
OCP
value and the voltage value is reduced according to the
load by the following relation:
V
OUTX
+ R
LOADX
I
OCP
(eq. 1)
VOUTX
IOCP
IOUTX
IOCP x RLOAD
Figure 5. Overload
− In case of short circuit or huge load, the current is
limited to the I
OCP
value within T
DET
time until the
short condition is removed. If the output remains
shorted or tied to a very low voltage, the junction
temperature of the chip exceeds T
SDOCP
value and the
device enters in thermal shutdown (MOSFET is
turned−off).
VOUTX
IOCP
IOUTX
Thermal
Regulation
Threshold
Timer
Regulation
Mode
TREGTOCP
Figure 6. Short Circuit
Then, the device enters in timer regulation mode,
described in 2 phases:
P1-P3P4-P6P7-P9P10-P10

NCP383LMUAJAATXG

Mfr. #:
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Manufacturer:
ON Semiconductor
Description:
Power Switch ICs - Power Distribution DUAL CHANNEL OCP
Lifecycle:
New from this manufacturer.
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