10
LTC1735-1
OPERATIO
U
(Refer to Functional Diagram)
POWER GOOD
A window comparator monitors the output voltage and its
open-drain output is pulled low when the divided down
output voltage (appearing at the V
OSENSE
pin) is not within
±7.5% of the reference voltage of 0.8V.
During a programmed output voltage transition (i.e., a
transition from 1.55V to 1.3V) the PGOOD open-drain
output will be pulled low and Burst Mode operation will be
disabled until the output voltage is within 7.5% of its newly
programmed value.
When the PGOOD pin is driven by an external oscillator
through a series resistor, cycle-skipping operation is
invoked and the internal oscillator is synchronized to the
external clock by comparator C. In this mode, the 25%
minimum inductor current clamp is removed, providing
low noise, constant frequency discontinuous operation
over the widest possible output current range. This con-
stant frequency operation is not quite as efficient as Burst
Mode operation, but does provide a lower noise, constant
frequency operation. When the power good window com-
parator indicates the output is not in regulation, the
PGOOD pin is pulled to ground and synchronization is
inhibited. Obviously when driving the PGOOD pin with an
external clock the power good indication is not available
unless additional circuitry is added.
If the PGOOD pin is tied to ground, continuous operation
is forced. This operation is the least efficient mode, but is
desirable in certain applications. The output can source
or sink current in this mode. When forcing continuous
operation and sinking current, current will be forced back
into the main power supply potentially boosting the input
supply to dangerous voltage levelsBEWARE.
APPLICATIO S I FOR ATIO
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The basic LTC1735-1 application circuit is shown in
Figure 1 on the first page of this data sheet. External
component selection is driven by the load requirement
and begins with the selection of R
SENSE
. Once R
SENSE
is known, C
OSC
and L can be chosen. Next, the power
MOSFETs and D1 are selected. The operating frequency
and the inductor are chosen based largely on the desired
amount of ripple current. Finally, C
IN
is selected for its
ability to handle the large RMS current into the converter
and C
OUT
is chosen with low enough ESR to meet the
output voltage ripple and transient specifications. The
circuit shown in Figure 1 can be configured for operation
up to an input voltage of 28V (limited by the external
MOSFETs).
R
SENSE
Selection For Output Current
R
SENSE
is chosen based on the required output current.
The LTC1735-1 current comparator has a maximum
threshold of 75mV/R
SENSE
and an input common mode
range of SGND to 1.1(INTV
CC
). The current comparator
threshold sets the peak of the inductor current, yielding a
maximum average output current I
MAX
equal to the peak
value less half the peak-to-peak ripple current, I
L
.
Allowing a margin for variations in the LTC1735-1 and
external component values yields:
R
mV
I
SENSE
MAX
=
50
C
OSC
Selection for Operating Frequency
and Synchronization
The choice of operating frequency and inductor value is
a trade-off between efficiency and component size. Low
frequency operation improves efficiency by reducing
MOSFET switching losses, both gate charge loss and
transition loss. However, lower frequency operation
requires more inductance for a given amount of ripple
current.
The LTC1735-1 uses a constant frequency architecture
with the frequency determined by an external oscillator
capacitor C
OSC
. Each time the topside MOSFET turns on,
the voltage on C
OSC
is reset to ground. During the on-time,
C
OSC
is charged by a fixed current. When the voltage on the
capacitor reaches 1.19V, C
OSC
is reset to ground. The
process then repeats.
11
LTC1735-1
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The value of C
OSC
is calculated from the desired operating
frequency assuming no external clock input on the PGOOD
pin:
CpF
Frequency
OSC
()
.( )
=
16110
11
7
A graph for selecting C
OSC
versus frequency is given in
Figure 2. The maximum recommended switching fre-
quency is 550kHz .
The internal oscillator runs at its nominal frequency (f
O
)
when the PGOOD pin is pulled high (to INTV
CC
) though a
series resistor or connected to ground. Clocking the
PGOOD pin above and below 1.2V will cause the internal
oscillator to injection-lock to an external clock signal
applied to the PGOOD pin with a frequency between 0.9f
O
and 1.3f
O
. The clock high level must exceed 1.3V for at
least 0.3µs, and the clock low level must be less than 0.3V
for at least 0.3µs. The top MOSFET turn-on will synchro-
nize with the rising edge of the external clock.
Attempting to synchronize to too high of an external
frequency (above 1.3f
O
) can result in inadequate slope
compensation and possible loop instability at high duty
cycles. If this condition exists, simply lower the value of
C
OSC
so (f
EXT
= f
O
) according to Figure 2.
clamp present in Burst Mode operation is removed,
providing constant frequency discontinuous operation
over the widest possible output current range. In this
mode the synchronous MOSFET is forced on once every
10 clock cycles to recharge the bootstrap capacitor. This
minimizes audible noise while maintaining reasonably
high efficiency.
Inductor Value Calculation
The operating frequency and inductor selection are inter-
related in that higher operating frequencies allow the use
of smaller inductor and capacitor values. So why would
anyone ever choose to operate at lower frequencies with
larger components? The answer is efficiency. A higher
frequency generally results in lower efficiency because of
MOSFET gate charge losses. In addition to this basic trade
off, the effect of inductor value on ripple current and low
current operation must also be considered.
The inductor value has a direct effect on ripple current. The
inductor ripple current I
L
decreases with higher induc-
tance or frequency and increases with higher V
IN
or V
OUT
:
I
fL
V
V
V
L OUT
OUT
IN
=
1
1
()()
Accepting larger values of I
L
allows the use of low
inductances, but results in higher output voltage ripple
and greater core losses. A reasonable starting point for
setting ripple current is I
L
= 0.3 to 0.4(I
MAX
). Remember,
the maximum I
L
occurs at the maximum input voltage.
The inductor value also has an effect on low current
operation. The transition to low current operation begins
when the inductor current reaches zero while the bottom
MOSFET is on. Burst Mode operation begins when the
average inductor current required results in a peak current
below 25% of the current limit determined by R
SENSE
.
Lower inductor values (higher I
L
) will cause this to occur
at higher load currents, which can cause a dip in efficiency
in the upper range of low current operation. In Burst Mode
operation, lower inductance values will cause the burst
frequency to decrease.
Figure 2. Timing Capacitor Value
OPERATING FREQUENCY (kHZ)
0 100 200 300 400 500 600
C
OSC
VALUE (pF)
1735-1 F02
100.0
87.5
75.0
62.5
50.0
37.5
25.0
12.5
0
When synchronized to an external clock, Burst Mode
operation is disabled but the inductor current is not
allowed to reverse. The 25% minimum inductor current
12
LTC1735-1
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Inductor Core Selection
Once the value for L is known, the type of inductor must be
selected. High efficiency converters generally cannot afford
the core loss found in low cost powdered iron cores,
forcing the use of more expensive ferrite, molypermalloy,
or Kool Mµ
®
cores. Actual core loss is independent of core
size for a fixed inductor value, but it is very dependent on
inductance selected. As inductance increases, core losses
go down. Unfortunately, increased inductance requires
more turns of wire and therefore copper losses will increase.
Ferrite designs have very low core loss and are preferred
at high switching frequencies, so design goals can
concentrate on copper loss and preventing saturation.
Ferrite core material saturates “hard,” which means that
inductance collapses abruptly when the peak design current
is exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
Molypermalloy (from Magnetics, Inc.) is a very good, low
loss core material for toroids, but it is more expensive than
ferrite. A reasonable compromise from the same
manufacturer is Kool Mµ. Toroids are very space efficient,
especially when you can use several layers of wire. Because
they generally lack a bobbin, mounting is more difficult.
However, designs for surface mount are available that do
not increase the height significantly.
Power MOSFET and D1 Selection
Two external power MOSFETs must be selected for use
with the LTC1735-1: an N-channel MOSFET for the top
(main) switch, and an N-channel MOSFET for the bottom
(synchronous) switch.
The peak-to-peak gate drive levels are set by the INTV
CC
voltage. This voltage is typically 5.2V during start-up (see
EXTV
CC
Pin Connection). Consequently, logic-level
threshold MOSFETs must be used in most LTC1735-1
applications. The only exception is when low input voltage
is expected (V
IN
< 5V); then, sub-logic level threshold
MOSFETs (V
GS(TH)
< 3V) should be used. Pay close
attention to the BV
DSS
specification for the MOSFETs as
well; most of the logic level MOSFETs are limited to 30V or
less.
Selection criteria for the power MOSFETs include the “ON”
resistance R
DS(ON)
, reverse transfer capacitance C
RSS
,
input voltage and maximum output current. When the
LTC1735-1 is operating in continuous mode the duty
cycles for the top and bottom MOSFETs are given by:
Main SwitchDuty Cycle
V
V
Synchronous SwitchDuty Cycle
VV
V
OUT
IN
IN OUT
IN
=
=
The MOSFET power dissipations at maximum output
current are given by:
P
V
V
IR
kV I C f
P
VV
V
IR
MAIN
OUT
IN
MAX DS ON
IN MAX RSS
SYNC
IN OUT
IN
MAX DS ON
=
()
+
()
+
()( )( )()
=
()
+
()
2
2
2
1
1
δ
δ
()
()
where δ is the temperature dependency of R
DS(ON)
and k
is a constant inversely related to the gate drive current.
Both MOSFETs have I
2
R losses while the topside
N-channel equation includes an additional term for transi-
tion losses, which are highest at high input voltages. For
V
IN
< 20V the high current efficiency generally improves
with larger MOSFETs, while for V
IN
> 20V the transition
losses rapidly increase to the point that the use of a higher
R
DS(ON)
device with lower C
RSS
actually provides higher
efficiency. The synchronous MOSFET losses are greatest
at high input voltage or during a short circuit when the duty
cycle in this switch is nearly 100%.
The term (1 + δ) is generally given for a MOSFET in the
form of a normalized R
DS(ON)
vs Temperature curve, but
δ = 0.005/°C can be used as an approximation for low
voltage MOSFETs. C
RSS
is usually specified in the
MOSFET characteristics. The constant k = 1.7 can be used
to estimate the contributions of the two terms in the main
switch dissipation equation.
The Schottky diode D1 shown in Figure 1 conducts during
the dead-time between the conduction of the two power
MOSFETs. This prevents the body diode of the bottom
Kool Mµ is a registered trademark of Magnetics, Inc.

LTC1735CS-1#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Hi Eff Sync Buck Sw Reg
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