NLX2G07AMUTCG

NLX2G07
www.onsemi.com
4
AC ELECTRICAL CHARACTERISTICS (Input t
r
= t
f
= 3.0 nS)
Symbol
Parameter
V
CC
(V)
Test
Condition
T
A
= 255C
T
A
= −555C
to +1255C
Unit
Min Typ Max Min Max
t
PZL
Propagation Delay
(Figures 3 and 4)
1.65−1.95
R
L
= R
1
= 5000 W,
C
L
= 15 pF
1.8 5.3 11.5 1.8 12
ns
2.3−2.7
R
L
= R
1
= 500 W,
C
L
= 50 pF
1.2 3.7 5.8 1.2 6.4
3.0−3.6
R
L
= R
1
= 500 W,
C
L
= 50 pF
0.8 2.9 4.4 0.8 4.8
4.5−5.5
R
L
= R
1
= 500 W,
C
L
= 50 pF
0.5 2.3 3.5 0.5 3.9
t
PLZ
Propagation Delay
(Figures 3 and 4)
1.65−1.95
R
L
= R
1
= 5000 W,
C
L
= 15 pF
1.8 5.3 11.5 1.8 12
ns
2.3−2.7
R
L
= R
1
= 500 W,
C
L
= 50 pF
1.2 2.8 5.8 1.2 6.4
3.0−3.6
R
L
= R
1
= 500 W,
C
L
= 50 pF
0.8 2.1 4.4 0.8 4.8
4.5−5.5
R
L
= R
1
= 500 W,
C
L
= 50 pF
0.5 1.4 3.5 0.5 3.9
C
IN
Input Capacitance 5.5 V
IN
= 0 V or V
CC
2.5 pF
C
OUT
Output Capacitance 5.5 V
IN
= 0 V or V
CC
4 pF
C
PD
Power Dissipation Capacitance
(Note 6)
3.3
5.5
10 MHz
V
IN
= 0 V or V
CC
4 pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation I
CC(OPR)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load
dynamic power consumption: P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC.
Figure 3. Switching Waveforms
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
R
T
= Z
OUT
of pulse generator (typically 50 W)
Figure 4. Test Circuit
50%
50% V
CC
t
PZL
t
PLZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
)0.3 V
A
Y
V
CC
2
R
1
NLX2G07
www.onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
NLX2G07MUTCG UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2G07AMUTCG UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G07CMUTCG UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NLX2G07
www.onsemi.com
6
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50

NLX2G07AMUTCG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers Dual Buffer w/ Open Drain Output
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union