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NLX2G07MUTCG
P1-P3
P4-P6
P7-P8
NLX2G07
www
.onsemi.com
4
AC ELECTRICAL CHARACTERISTICS
(Input t
r
= t
f
= 3.0 nS)
Symbol
Parameter
V
CC
(V)
T
est
Condition
T
A
= 25
5
C
T
A
= −55
5
C
to +125
5
C
Unit
Min
Ty
p
Max
Min
Max
t
PZL
Propagation Delay
(Figures 3 and 4)
1.65−1.95
R
L
= R
1
= 5000
W
,
C
L
= 15 pF
1.8
5.3
1
1.5
1.8
12
ns
2.3−2.7
R
L
= R
1
= 500
W
,
C
L
= 50 pF
1.2
3.7
5.8
1.2
6.4
3.0−3.6
R
L
= R
1
= 500
W
,
C
L
= 50 pF
0.8
2.9
4.4
0.8
4.8
4.5−5.5
R
L
= R
1
= 500
W
,
C
L
= 50 pF
0.5
2.3
3.5
0.5
3.9
t
PLZ
Propagation Delay
(Figures 3 and 4)
1.65−1.95
R
L
= R
1
= 5000
W
,
C
L
= 15 pF
1.8
5.3
1
1.5
1.8
12
ns
2.3−2.7
R
L
= R
1
= 500
W
,
C
L
= 50 pF
1.2
2.8
5.8
1.2
6.4
3.0−3.6
R
L
= R
1
= 500
W
,
C
L
= 50 pF
0.8
2.1
4.4
0.8
4.8
4.5−5.5
R
L
= R
1
= 500
W
,
C
L
= 50 pF
0.5
1.4
3.5
0.5
3.9
C
IN
Input Capacitance
5.5
V
IN
= 0 V or V
CC
2.5
pF
C
OUT
Output Capacitance
5.5
V
IN
= 0 V or V
CC
4
pF
C
PD
Power Dissipation Capacitance
(Note 6)
3.3
5.5
10 MHz
V
IN
= 0 V or V
CC
4
pF
6.
C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation I
CC(OPR)
= C
PD
•
V
CC
•
f
in
+ I
CC
. C
PD
is used to determine the no−load
dynamic power consumption: P
D
= C
PD
•
V
CC
2
•
f
in
+ I
CC
•
V
CC.
Figure 3. Switching W
aveforms
PULSE
GENERA
TOR
R
T
DUT
V
CC
R
L
C
L
R
T
= Z
OUT
of pulse generator (typically 50
W
)
Figure 4. T
est Circuit
50%
50% V
CC
t
PZL
t
PLZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
)
0.3 V
A
Y
V
CC
2
R
1
NLX2G07
www
.onsemi.com
5
ORDERING
INFORMA
TION
Device
Package
Shipping
†
NLX2G07MUTCG
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / T
ape & Reel
NLX2G07AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / T
ape & Reel
NLX2G07CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / T
ape & Reel
†
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T
ape and Reel
Packaging
Specifications Brochure, BRD801
1/D.
NLX2G07
www
.onsemi.com
6
P
ACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETERS.
3.
DIMENSION b APPLIES TO PLA
TED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4.
COPLANARITY APPLIES TO THE EXPOSED
P
AD AS WELL AS THE TERMINALS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
C
L
5X
NOTE 3
2X
0.10
C
PIN ONE
REFERENCE
TOP
VIEW
2X
0.10
C
10X
A
A1
(A3)
0.08
C
0.10
C
C
SEA
TING
PLANE
SIDE VIEW
L2
1
3
4
6
DIM
MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.127 REF
b
0.15
0.25
D
1.20 BSC
E
1.00 BSC
e
0.40 BSC
L
0.30
0.40
L1
0.00
0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For
additional information on our Pb−Free strategy and soldering
details, please download the
ON Semiconductor Soldering and
Mounting T
echniques Reference Manual, SOLDERRM/D.
L1
DET
AIL A
Bottom View
(Optional)
A1
A3
DET
AIL B
Side View
(Optional)
EDGE OF P
ACKAGE
MOLD CMPD
EXPOSED Cu
L2
0.40
0.50
P1-P3
P4-P6
P7-P8
NLX2G07MUTCG
Mfr. #:
Buy NLX2G07MUTCG
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers Dual Buffer w/ Open Drain Output
Lifecycle:
New from this manufacturer.
Delivery:
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EMS
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