Si590/591
Rev. 1.2 5
\
Table 5. CLK± Output Period Jitter
Parameter Symbol Test Condition Min Typ Max Units
Period Jitter* J
PER
RMS — — 3 ps
Peak-to-Peak — — 35
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.
Table 6. Environmental Compliance and Package Information
Parameter Conditions/Test Method
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Contact Pads Gold over Nickel
Table 7. Thermal Characteristics
(Typical values T
A
=25ºC, V
DD
=3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
5x7mm, Thermal Resistance Junction to
Ambient
JA
Still Air — 84.6 — °C/W
5x7mm, Thermal Resistance Junction to
Case
JC
Still Air — 38.8 — °C/W
3.2x5mm, Thermal Resistance Junction to
Ambient
JA
Still Air — 31.1 — °C/W
3.2x5mm, Thermal Resistance Junction to
Case
JC
Still Air — 13.3 — °C/W
Ambient Temperature T
A
–40 — 85 °C
Junction Temperature T
J
——125°C
