during ESD tests), it can be connected to VREF
through a 4.7k
resistor.
Pin 4.
VREF (Reference Voltage). The device is
provided with an accurate voltage reference
(5V
±
1.5%) able to deliver some mA to an external
circuit.
A small film capacitor (0.1
µ
F typ.), connected
between this pin and SGND, is recommended to
ensure the stability of the generator and to prevent
noise from affecting the reference.
Before device turn-on, this pin has a sink current ca-
pability of 0.5mA.
Pin 5.
VFB (Error Amplifier Inverting Input). The
feedback signal is applied to this pin and is com-
pared to the E/A internal reference (2.5V). The
E/A output generates the control voltage which
fixes the duty cycle.
The E/A features high gain-bandwidth product,
which allows to broaden the bandwidth of the
overall control loop, high slew-rate and current ca-
pability, which improves its large signal behavior.
Usually the compensation network, which stabi-
lizes the overall control loop, is connected be-
tween this pin and COMP (pin 6).
Pin 6.
COMP (Error Amplifier Output). Usually,
this pin is used for frequency compensation and
the relevant network is connected between this
pin and VFB (pin 5). Compensation networks to-
wards ground are not possible since the L5991
E/A is a voltage mode amplifier (low output im-
pedance). See application ideas for some exam-
ple of compensation techniques.
It is worth mentioning that the calculation of the
part values of the compensation network must
take the standby frequency operation into ac-
count. In particular, this means that the open-loop
crossover frequency must not exceed f
SB
/4
÷
f
SB
/5.
The voltage on pin 6 is monitored in order to re-
duce the oscillator frequency when the converter
is lightly loaded (standby).
Pin 7.
SS (Soft-Start). At device start-up, a ca-
pacitor (Css) connected between this pin and
SGND (pin 12) is charged by an internal current
generator, ISSC, up to about 7V. During this
ramp, the E/A output is clamped by the voltage
across Css itself and allowed to rise linearly, start-
ing from zero, up to the steady-state value im-
posed by the control loop. The maximum time in-
terval during which the E/A is clamped, referred to
as soft-start time, is approximately:
T
ss
3
R
sense
I
Qpk
I
SSC
C
ss
(7)
where R
sense
is the current sense resistor (see pin
13) and I
Qpk
is the switch peak current (flowing
through R
sense
), which depends on the output
load. Usually, C
SS
is selected for a T
SS
in the or-
der of milliseconds.
As mentioned before, the soft-start intervenes
also in case of severe overload or short circuit on
the output. Referring to fig. 25, pulse-by-pulse
current limitation is somehow effective as long as
the ON-time of the power switch can be reduced
(from A to B). After the minimum ON-time is
reached (from B onwards) the current is out of
control.
To prevent this risk, a comparator trips an over-
current handling procedure, named ’hiccup’ mode
operation, when a voltage above 1.2V (point C) is
detected on current sense input (ISEN, pin 13).
Basically, the IC is turned off and then soft-started
as long as the fault condition is detected. As a re-
sult, the operating point is moved abruptly to D,
creating a foldback effect. Fig. 26 illustrates the
operation.
The oscillation frequency appearing on the soft-
start capacitor in case of permanent fault, referred
to as ’hiccup" period, is approximately given by:
T
hic
4.5
1
I
SSC
+
1
I
SSD
C
ss
(
8
)
+
-
R2
R1
R
A
C
T
D97IN727A
V
REF
RCT
DC
TO PWM LOGIC
4
3
2
23K
28K
3µA
R
B
ST-BY
16
Figure 24. Duty cycle control.
V
OUT
T
ON
D.C.M. C.C.M.
D
A
B
C
I
Qpk
T
ON(min)
1-2 ·I
Qpk
I
Qpk(max)
I
OUT
I
SHORT
I
OUT(max)
D97IN495
Figure 25. Regulation characteristic and re-
lated quantities.
L5991 - L5991A
10/23
Since the system tries restarting each hiccup cy-
cle, there is not any latchoff risk.
"Hiccup" keeps the system in control in case of
short circuits but does not eliminate power com-
ponents overstress during pulse-by-pulse limita-
tion (from A to C). Other external protection cir-
cuits are needed if a better control of overloads is
required.
Pin 8.
VCC (Controller Supply). This pin supplies
the signal part of the IC. The device is enabled as
VCC voltage exceeds the start threshold and
works as long as the voltage is above the UVLO
threshold. Otherwise the device is shut down and
the current consumption is extremely low
(<150
µ
A). This is particularly useful for reducing
the consumption of the start-up circuit (in the sim-
plest case, just one resistor), which is one of the
most significant contributions to power losses in
standby.
An internal Zener limits the voltage on VCC to
25V. The IC current consumption increases con-
siderably if this limit is exceeded.
A small film capacitor between this pin and SGND
(pin 12), placed as close as possible to the IC, is
recommended to filter high frequency noise.
Pin 9.
VC (Supply of the Power Stage). It supplies
the driver of the external switch and therefore ab-
sorbs a pulsed current. Thus it is recommended to
place a buffer capacitor (towards PGND, pin 11,
as close as possible to the IC) able to sustain
these current pulses and in order to avoid them
inducing disturbances.
This pin can be connected to the buffer capacitor
directly or through a resistor, as shown in fig. 27,
to control separately the turn-on and turn-off
speed of the external switch, typically a Power-
MOS. At turn-on the gate resistance is R
g
+ R
g’
, at
turn-off is R
g
only.
Pin 10.
OUT (Driver Output). This pin is the out-
put of the driver stage of the external power
switch. Usually, this will be a PowerMOS, al-
though the driver is powerful enough to drive
BJT’s (1.6A source, 2A sink, peak).
The driver is made up of a totem pole with a high-
side NPN Darlington and a low-side VDMOS, thus
there is no need of an external diode clamp to
prevent voltage from going below ground. An in-
ternal clamp limits the voltage delivered to the
gate at 13V. Thus it is possible to supply the
driver (Pin 9) with higher voltages without any risk
of damage for the gate oxide of the external MOS.
The clamp does not cause any additional in-
crease of power dissipation inside the chip since
the current peak of the gate charge occurs when
the gate voltage is few volts and the clamp is not
active. Besides, no current flows when the gate
voltage is 13V, steady state.
Under UVLO conditions an internal circuit (shown
7V
T
hic
time
SHORT
I
OUT
I
SEN
FAULT
SS
5V
0.5V
D98IN986
Figure 26. Hiccup mode operation.
OUT
Rg
DRIVE &
CONTROL
13V
V
C
V
CC
Rg'
PGND
Rg(ON)=Rg+Rg'
Rg(OFF)=Rg
D97IN726
L5991
9
10
11
8
Figure 27. Turn-on and turn-off speeds adjust-
ment.
L5991 - L5991A
11/23
in fig.28) holds the pin low in order to ensure that
the external MOS cannot be turned on acciden-
tally. The peculiarity of this circuit is its ability to
mantain the same sink capability (typically, 20mA
@ 1V) from V
CC
= 0V up to the start-up threshold.
When the threshold is exceeded and the L5991
starts operating, V
REFOK
is pulled high (refer to fig.
28) and the circuit is disabled.
It is then possible to omit the "bleeder" resistor
(connected between the gate and the source of
the MOS) ordinarily used to prevent undesired
switching-on of the external MOS because of
some leakage current.
Pin 11.
PGND (Power Ground). The current loop
during the discharge of the gate of the external
MOS is closed through this pin. This loop should
be as short as possible to reduce EMI and run
separately from signal currents return.
Pin 12
. SGND (Signal Ground). This ground refer-
ences the control circuitry of the IC, so all the
ground connections of the external parts related
to control functions must lead to this pin. In laying
out the PCB, care must be taken in preventing
switched high currents from flowing through the
SGND path.
Pin 13.
ISEN (Current Sense). This pin is to be
connected to the "hot" lead of the current sense
resistor R
sense
(being the other one grounded), to
get a voltage ramp which is an image of the cur-
rent of the switch (I
Q
). When this voltage is equal
to:
V
13pk
=
I
Qpk
R
sense
=
V
COMP
1.4
3
(
9
)
the conduction of the switch is terminated.
To increase the noise immunity, a "Leading Edge
Blanking" of about 100ns is internally realized as
shown in fig. 29. Because of that, the smoothing
RC filter between this pin and R
sense
could be re-
moved or, at least, considerably reduced.
Pin 14.
DIS (Device Disable). When the voltage
on pin 14 rises above 2.5V the IC is shut down
and it is necessary to pull VCC (IC supply voltage,
pin 8) below the UVLO threshold to allow the de-
vice to restart.
The pin can be driven by an external logic signal
in case of power management, as shown in fig.
30. It is also possible to realize an overvoltage
protection, as shown in the section " Application
Ideas".If used, bypass this pin to ground with a fil-
ter capacitor to avoid spurious activation due to
noise spikes. If not, it must be connected to
SGND.
Pin 15.
DC-LIM (Maximum Duty Cycle Limit). The
upper extreme, Dx, of the duty cycle range de-
pends on the voltage applied to this pin. Approxi-
mately,
D
x
R
T
R
T
+
230
(
10
)
if DC-LIM is grounded or left floating. Instead,
+
-
I
D97IN503
ISEN
0
3V
CLK
2V
+
-
+
-
1.2V
FROM E/A
OVERCURRENT
COMPARATOR
PWM
COMPARATOR
TO PWM
LOGIC
TO FAULT
LOGIC
13
Figure 29. Internal LEB.
10
12
SGND
OUT
V
REFOK
D97IN538
Figure 28. Pull-Down of the output in UVLO.
L5991 - L5991A
12/23

E-L5991A

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC REG CTRLR FLYBACK 16DIP
Lifecycle:
New from this manufacturer.
Delivery:
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