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Ordering information EMIF02-MIC03C2
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Figure 12. Flip-Chip tape and reel specification
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
4 Ordering information
5 Revision history
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 ± 0.1
8 ± 0.3
4 ± 0.1
1.75 ± 0.1
3.5 ± 0.1
Ø 1.5 ± 0.1
0.73 ± 0.05
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E E E
Ordering code Marking Package Weight Base qty Delivery mode
EMIF02-MIC03C2 FW Flip-Chip 2.3 mg 5000 7” Tape and reel
Date Revision Changes
28-Nov-2006 1 Initial release.
Obsolete Product(s) - Obsolete Product(s)
