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FN2945.9
Die Characteristics
DIE DIMENSIONS:
63 mils x 44 mils x 19 mils
1600µm x 1130µm
METALLIZATION:
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8k
Å ±0.4kÅ
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
PASSIVATION:
Type: Nitride
Thickness: 4k
Å ±0.5kÅ
TRANSISTOR COUNT:
52
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1100
+IN
V-
V
L
BAL
OUT
-IN
BAL
V
H
V+
HFA1100
