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CAP200DG-TL

P1-P3P4-P6P7-P8
CAP200DG
CAPZero-2
Zero
1
Loss Automatic X Capacitor Discharge IC
www.power.com May 2015
This Product is Covered by Patents and/or Pending Patent Applications.
™
Component Table
Product
3
BV
DSS
Total
X Capacitance
Total Series
Resistance
2
(R1 + R2)
CAP200DG 1000 V 100 nF to 6 mF 7.5 M W to 142 kW
Table 1. Component Table.
Notes:
1. IEC 62301 clause 4.5 rounds standby power use below 5 mW to zero.
2. Values are nominal. RC time constant is <1 second.
3. Packages: D: SO-8.
Product Highlights
• One part to cover X capacitor values from 100 nF to 6 mF
• Blocks current through X capacitor discharge resistors when AC
voltage is connected
• Automatically discharges X capacitors through discharge resistors
when AC is disconnected
• Simplies EMI lter design – larger X capacitor allows smaller
inductive components with no change in consumption
• Only two terminals – meets safety standards for use before or after
system input fuse
• >4 mm creepage on package and PCB
• Self supplied – no external bias required
• High common mode surge immunity – no external ground connection
• High differential surge withstand – 1000 V internal MOSFETs
• NEMKO and CB certication
EcoSmart™– Energy Efcient
• <5 mW consumption at 230 VAC for all X capacitor values
Applications
• All AC-DC converters with X capacitors of 100 nF up to 6 mF
• Appliances requiring EuP Lot 6 compliance
• Adapters requiring ultra low no-load consumption
• All converters requiring very low standby power
• Lossless generation of zero crossing signal
Description
When AC voltage is applied, CAP200DG blocks current ow in the
X capacitor safety discharge resistors, reducing the power loss to less
than 5 mW, or essentially zero
1
at 230 VAC. When AC voltage is
disconnected, CAP200DG automatically discharges the X capacitor by
connecting the series discharge resistors. This operation allows total
exibility in the choice of the X capacitor to optimize differential mode
EMI ltering and reduce inductor costs, with no change in power
consumption.
Designing with CAP200DG is simply a matter of selecting the appropri-
ate external resistor values for the X capacitor value being used to
achieve the necessary time constant. The simplicity and ruggedness of
the two terminal CAP200DG IC makes it an ideal choice in systems
designed to meet EuP Lot 6 requirements.
Figure 1. Typical Application – Not a Simplied Circuit.
Figure 2. SO-8 D Package.
PI-7507-012015
D1
R1
AC
R2
X Capacitor
CAP200DG
D2
MOV
and Other
EMI Filter
Components
Rev. B 05/15
2
CAP200DG
www.power.com
Figure 3. Pin Conguration.
Pin Functional Description
The pin conguration of Figure 3 ensures that the width of the SO-8
package is used to provide creepage and clearance distance of over
4 mm.
Although electrical connections are only made to pins 2, 3, 6 and 7, it
is recommended that pins 1-4 and pins 5-8 are coupled together on
the PCB – see Applications Section.
PI-5608-020515
D Package (SO-8)
NC
D1
D1
NC
1
2
3
4
8
7
6
5
NC
D2
D2
NC
Figure 4. Placement Options of MOV and C
EXT
.
Key Application Considerations
Breakdown Voltage Selection
The system conguration variables include the placement of the
system MOV and X capacitor(s) as well as the differential surge
voltage specications of the application.
As shown in Table 1, the CAP200DG has a breakdown voltage of
1000 V. For applications where the system MOV is placed in position
1 (MOV
POS1
in Figure 4), the CAP200DG will provide adequate voltage
withstand for surge requirements of 3 kV or higher.
For MOV placement that is not directly across the X Capacitor1 (for
example MOV
POS2
in Figure 4) the 1000 V CAP200DG devices can be
used up to a surge specication of 1.5 kV. For differential surge
voltage specications of >1.5 kV it is recommended that the MOV
is always placed in the location shown in Figure 4 as MOV
POS1
.
It is always recommended that the peak voltage between terminals
D1 and D2 of CAP200DG is measured during surge tests in the nal
system. Measurements of peak voltage across CAP200DG during
surge tests should be made with oscilloscope probes having appropri-
ate voltage rating and using an isolated supply to the oscilloscope to
avoid ground currents inuencing measurement results. When
making such measurements, it is recommended that 50 V engineer-
ing margin is allowed below the breakdown voltage specication
(for example 950 V with the 1000 V CAP200DG).
PI-7508-012015
X Capacitor1
C
EXT
AC
X Capacitor2
MOV
POS1
MOV
POS2
Other EMI
Filter
Components
D1
R1
R2
CAP200DG
D2
Rev. B 05/15
3
CAP200DG
www.power.com
If the measured peak Drain voltage exceeds 950 V, an external 1 kV
ceramic capacitor of value up to 47 pF can also be placed between
D1 and D2 terminals to attenuate the voltage applied between the
CAP200DG terminals during surge. This optional external capacitor
placement is shown as C
EXT
in Figure 4. It should be noted that use
of an external capacitor in this way will increase power consumption
slightly due to the C
EXT
charge/discharge currents owing in R1 and
R2 while AC is connected. A C
EXT
value of 33 pF will add approximately
0.5 mW at 230 VAC, 50 Hz.
PCB Layout and External Resistor Selection
Figure 5 shows a typical PCB layout conguration for CAP200DG. The
external resistors in this case are divided into two separate surface
mount resistors to distribute loss under fault conditions – for example
where a short-circuit exists between CAP200DG terminals D1 and D2.
R1 and R2 values are selected according to Table 1.
Under a fault condition where CAP200DG terminals D1 and D2 are
shorted together, each resistor will dissipate a power that can be
calculated from the applied AC voltage and the R1 and R2 values.
For example, in an application with R1=R2=75 kW. If CAP200DG is
shorted out at 265 VAC then R1 and R2 will each dissipate 234 mW.
Resistors R1 and R2 should also be rated for 50% of the system input
voltage again to allow for the short-circuitry of CAP200DG D1 to D2
pins during single point fault testing.
If lower dissipation or lower voltage across each resistor is required
during fault tests, the total external resistance can be divided into
more discrete resistors, however the total resistance must be equal to
or greater than 150 kW.
Safety
CAP200DG meets safety requirements even if placed before the
system input fuse. If a short-circuit is placed between D1 and D2
terminals of CAP200DG, the system is identical to existing systems
where CAP200DG is not used.
With regard to open circuit tests, it is not possible to create a fault
condition through a single pin fault (for example lifted pin test) since
there are two pins connected to each of D1 and D2. If several pins
are lifted to create an open circuit, the condition is identical to an
open circuit X capacitor discharge resistor in existing systems where
Figure 5. Typical PCB Layout.
PI-5610-020515
R1
X Capacitor
R2
≥4 mm
CAP200DG is not used. If redundancy against open circuit faults is
required, two CAP200DG and R1 / R2 congurations can be placed in
parallel.
Discharge Operation
To meet the safety regulations, when the AC supply is disconnected,
CAP200DG will discharge the X capacitor to the safety extra low
voltage (SELV) levels according to the above functional description.
Although there are no specic safety requirements below SELV,
CAP200DG still continues the discharge until the X capacitor is fully
discharged. As such CAP200DG can be safely used at low input
voltages such as the common industrial 18 VAC and 24 VAC supply
rails while retaining X capacitor discharge when the AC source is
disconnected.
P1-P3P4-P6P7-P8

CAP200DG-TL

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Buy CAP200DG-TL
Manufacturer:
Power Integrations
Description:
Power Management Specialized - PMIC CapZero-2 X Cap Smart HV Switches
Lifecycle:
New from this manufacturer.
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