ADG451/ADG452/ADG453
Rev. C | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameters Ratings
V
DD
to V
SS
44 V
V
DD
to GND −0.3 V to +32 V
V
SS
to GND +0.3 V to −32 V
V
L
to GND −0.3 V to V
DD
+ 0.3 V
Analog, Digital Inputs
1
V
SS
− 2 V to V
DD
+ 2 V or 30 mA,
whichever occurs first
Continuous Current, S or D 100 mA
Peak Current, S or D (pulsed at
1 ms, 10% duty cycle maximum)
300 mA
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Plastic DIP Package,
Power Dissipation
470 mW
θ
JA
Thermal Impedance 117°C/W
Lead Temperature, Soldering
(10 sec)
260°C
SOIC Package, Power Dissipation 600 mW
θ
JA
Thermal Impedance 77°C/W
TSSOP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 115°C/W
θ
JC
Thermal Impedance 35°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
ESD 2 kV
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
ESD CAUTION
