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GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead-free finish of plated
Nickel/Tin.
HOW TO ORDER
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
±20% Preferred
Operation
X7R = -55°C to +125°C
Temperature Range
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature Coefficient
±15% (0VDC), ±22% (X7S)
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
Insulation Resistance
100,000MΩ min, or 1,000MΩ per
(@+25°C, RVDC)
μF min.,whichever is less
Dielectric Strength
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
CTE (ppm/C)
12.0
Thermal Conductivity
4-5W/M K
Terminations
Plated Nickel and Solder
Available
W
Style
3
IDC
Case
Size
2 = 0508
3 = 0612
4 = 0306
L
Low
Inductance
1
Number
of
Terminals
1 = 8 Terminals
6
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D
Dielectric
C = X7R
D = X5R
Z = X7S
225
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
M = ±20%
T
Termination
T = Plated Ni
and Sn
3
Packaging
Available
1=7" Reel
3=13" Reel
A
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
A
Failure
Rate
A = N/A
0612
0508
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE
0306
