Data Sheet HMC558A
Rev. 0 | Page 15 of 15
OUTLINE DIMENSIONS
05-05-2016-A
KG-004837
0.50
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
SEATING
PLANE
0.92 MAX
1
4
6
7
9
10
12
3
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.36
0.30
0.24
P
I
N
1
(
0
.
3
2
×
0
.
3
2
)
EXPOSED
PAD
PIN 1
INDICATOR
3.13
3.00 SQ
2.87
2.10 BSC
1.00 REF
1.60
1.50 SQ
1.40
Figure 36. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range Description
Package
Option
Package Body
Material
Lead
Finish
MSL
Rating Branding
HMC558ALC3B −40°C to +85°C 12-Terminal Ceramic
Leadless Chip Carrier [LCC]
E-12-1 Alumina
Ceramic
Gold over
Nickel
MSL3 H558A
XXXX
HMC558ALC3BTR −40°C to +85°C 12-Terminal Ceramic
Leadless Chip Carrier [LCC]
E-12-1 Alumina
Ceramic
Gold over
Nickel
MSL3 H558A
XXXX
HMC558ALC3BTR-R5 −40°C to +85°C 12-Terminal Ceramic
Leadless Chip Carrier [LCC]
E-12-1 Alumina
Ceramic
Gold over
Nickel
MSL3 H558A
XXXX
EV1HMC558ALC3B Evaluation PCB Assembly
1
Z = RoHS Compliant Part.
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15000-0-11/16(0)
