Datasheet revision 1.0 www.chipquik.com
Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (10g syringe)
Product Highlights
Used for soldering Aluminum to Aluminum, Aluminum to
Copper, Aluminum to Brass, Aluminum to plated terminals
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Compatible with enclosed print heads
RoHS II and REACH compliant
Specifications
Alloy: Sn96.5/Ag3.5
Mesh Size: T3
Micron (µm) Range: 25-45
Flux Type: Synthetic Water-Soluble
Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60°C+) or IPA)
Metal Load: 75% Metal by Weight
Melting Point: 221°C (430°F)
Packaging: 5cc/10g Syringe
Shelf Life: Refrigerated >12 months, Unrefrigerated >6 months *See notes below:
*Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually
inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product
thoroughly for 2-3 minutes before inspection and use.
Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal
powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you
have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain
original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.
Printer Operation
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
>12 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
1 © 1994-2018 Chip Quik® Inc.
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