ICS-40300
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-445, Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES (GENERAL)
AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
AN-1165, Op Amps for Microphone Preamp Circuits
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit
APPLICATION NOTE (PRODUCT-SPECIFIC)
AN-0284 Low-Noise Directional Studio Microphone Reference Design
Page 10 of 16
Document Number: DS-ICS-40300-00
Revision: 1.0
ICS-40300
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the ICS-40300 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 14. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 15. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
Figure 14. PCB Land Pattern Layout
Dimensions shown in millimeters
Figure 15. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
2.62
ø1.10
ø1.68
ø0.70 (2×)
ø0.90 (3×)
2.40
1.20
2.54
0.79
1.27
1.27
1.2
2.54
2.62
3.41
2.4
Ø0.85 (3×)
1.8/1.3 DIA. 0.2032 CUT WI DTH (4×) Ø0.649 (2×)
Page 11 of 16
Document Number: DS-ICS-40300-00
Revision: 1.0
ICS-40300
PCB MATERIAL AND THICKNESS
The performance of the ICS-40300 is not affected by PCB thickness. The ICS-40300 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 12 of 16
Document Number: DS-ICS-40300-00
Revision: 1.0

ICS-40300

Mfr. #:
Manufacturer:
TDK InvenSense
Description:
MEMS Microphones High SPL Analog Microphone with Extended Low Frequency Response
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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