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MC74LCX02DR2G

P1-P3P4-P6P7-P7
MC74LCX02
http://onsemi.com
4
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
OUT
Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
WAVEFORM 1 − PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
Vcc
0 V
V
OH
V
OL
An, Bn
On
t
PLH
t
PHL
Vmi
Vmo
Vmi
Vmo
Vcc
Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V
Vmi 1.5 V 1.5 V Vcc/2
Vmo 1.5 V 1.5 V Vcc/2
Figure 2. AC Waveforms
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
C
L
= 50 pF at V
CC
= 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)
C
L
= 30 pF at V
CC
= 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)
R
L
= R
1
= 500 W or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 W)
Figure 3. Test Circuit
MC74LCX02
http://onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
†
MC74LCX02DG SOIC−14 NB
(Pb−Free)
55 Units / Rail
MC74LCX02DR2G SOIC−14 NB
(Pb−Free)
2500 Tape & Reel
MC74LCX02DTG TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LCX02DTR2G TSSOP−14
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74LCX02
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
−U−
SEATING
PLANE
0.10 (0.004)
−T−
SECTION N−N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

MC74LCX02DR2G

Mfr. #:
Buy MC74LCX02DR2G
Manufacturer:
ON Semiconductor
Description:
Logic Gates 2-3.6V Quad 2-Input NOR
Lifecycle:
New from this manufacturer.
Delivery:
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