MC10H116MG

Semiconductor Components Industries, LLC, 2016
August, 2016 Rev. 11
1 Publication Order Number:
MC10H116/D
MC10H116
Triple Line Receiver
Description
The MC10H116 is a triple differential amplifier designed for use in
sensing differential signals over long lines and is a functional/pinout
duplication of the MC10116, with 100% improvement in propagation
delay and no increase in power supply current. For termination
information see AND8020
.
Features
Propagation Delay, 1.0 ns Typical
Power Dissipation 85 mW Typ/Pkg (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K Compatible
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
Figure 1. Logic Diagram
*V
BB
to be used to supply bias to the MC10H116 only and bypassed
(when used) with 0.01ĂmF to 0.1 mF capacitor to ground (0 V). V
BB
can
source < 1.0 mA.
The MC10H116 is designed to be used in sensing differential signals
over long lines. The bias supply (V
BB
) is made available to make the
device useful as a Schmitt trigger, or in other applications where a
stable reference voltage is necessary.
Active current sources provide these receivers with excellent
commonmode noise rejection. If any amplifier in a package is not
used, one input of that amplifier must be connected to V
BB
to prevent
unbalancing the currentsource bias network.
The MC10H116 does not have internalinput pull down resistors.
This provides high impedance to the amplifier input and facilitates
differential connections.
Applications:
Low Level Receiver Voltage Level
Schmitt Trigger Interface
Figure 2. Dip Pin Assignment
V
CC1
A
OUT
A
OUT
A
IN
A
IN
B
OUT
B
OUT
V
EE
V
CC2
C
OUT
C
OUT
C
IN
C
IN
V
BB
B
IN
B
IN
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
5
4
11
3
2
10
9
7
6
13
12
15
14
When input pin with
bubble goes positive
it’s respective output
pin with bubble goes
positive.
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
V
BB
*
Pin assignment is for DualinLine Package.
For PLCC pin assignment, see TND309, the Pin Conversion Tables,
page 9.
MARKING DIAGRAMS*
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
PDIP16
P SUFFIX
CASE 64808
PLCC20
FN SUFFIX
CASE 77502
SOIC16
D SUFFIX
CASE 751B05
1
16
1
16
10H116G
AWLYWW
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20
1
10H116G
AWLYYWW
120
16
1
MC10H116P
AWLYYWWG
16
1
*For additional marking information, refer to
Application Note AND8002/D
.
For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
.
ORDERING INFORMATION
Device Package Shipping
MC10H116DG SOIC16
(Pb-Free)
48 Units/Tube
MC10H116DR2G SOIC16
(Pb-Free)
2500/Tape & Reel
PLCC20
(Pb-Free)
MC10H116FNR2G 500/Tape & Reel
PLCC20
(Pb-Free)
MC10H116FNG 46 Units/Tube
PDIP16
(Pb-Free)
MC10H116PG 25 Units/Tube
MC10H116
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2
Table 1. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
V
EE
Power Supply (V
CC
= 0) 8.0 to 0 Vdc
V
I
Input Voltage (V
CC
= 0) 0 to V
EE
Vdc
I
out
Output Current
Continuous
Surge
50
100
mA
T
A
Operating Temperature Range 0 to +75 °C
T
stg
Storage Temperature Range
Plastic
Ceramic
55 to +150
55 to +165
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (V
EE
= 5.2 V ±5%) (Note 2)
0° 25° 75°
Symbol Characteristic Min Max Min Max Min Max Unit
I
E
Power Supply Current 23 21 23 mA
I
inH
Input Current High 150 95 95
mA
I
CBO
Input Leakage Current 1.5 1.0 1.0
mA
V
BB
Reference Voltage 1.38 1.27 1.35 1.25 1.31 1.19 Vdc
V
OH
High Output Voltage 1.02 0.84 0.98 0.81 0.92 0.735 Vdc
V
OL
Low Output Voltage 1.95 1.63 1.95 1.63 1.95 1.60 Vdc
V
IH
High Input Voltage (Note 1) 1.17 0.84 1.13 0.81 1.07 0.735 Vdc
V
IL
Low Input Voltage (Note 1) 1.95 1.48 1.95 1.48 1.95 1.45 Vdc
V
CMR
Common Mode Range (Note 4) 2.85 to 0.8 Vdc
V
PP
Input Sensitivity (Note 3) 150 typ mV
PP
1. When V
BB
is used as the reference voltage.
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 ohm resistor to 2.0 V.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
pp
differential input required to obtain full logic swing on output.
Table 3. AC CHARACTERISTICS
0° 25° 75°
Symbol Characteristic Min Max Min Max Min Max Unit
t
pd
Propagation Delay 0.4 1.3 0.4 1.3 0.45 1.45 ns
t
r
Rise Time 0.5 1.5 0.5 1.6 0.5 1.7 ns
t
f
Fall Time 0.5 1.5 0.5 1.6 0.5 1.7 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
MC10H116
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3
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 77502
ISSUE F
M
N
L
Y BRK
W
V
D
D
S
L-M
M
0.007 (0.180) N
S
T
S
L-M
M
0.007 (0.180) N
S
T
S
L-M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW DD
20 1
S
L-M
M
0.007 (0.180) N
S
T
S
L-M
M
0.007 (0.180) N
S
T
S
L-M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
L-M
M
0.007 (0.180) N
S
T
S
L-M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM T, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.021 0.33 0.53
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____

MC10H116MG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC LINE RCVR TRIPLE ECL 16SOEIAJ
Lifecycle:
New from this manufacturer.
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