
OP07D
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage ±18 V
Input Voltage ±V supply
Differential Input Voltage ±0.7 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec) +300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4.
Package Type θ
JA
θ
JC
Unit
8-Lead DIP (N-8) 103 43 °C/W
8-Lead SOIC (R-8) 158 43 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanen
t damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.