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m39l0rx0x0x0U3.fm - Rev. D 9/13 EN
15 ©2011 Micron Technology, Inc. All rights reserved.
128Mb, 256Mb NOR Flash and 128Mb, 512Mb LPDDR MCP
Part Numbering
Part Numbering
Notes: 1. Devices are shipped from the factory with the memory content bits erased to 1. For a list of
available options (speed, package, etc.), for daisy chain ordering information, or for further
information on any aspect of this device, contact the nearest Micron sales office.
Table 6: Ordering Information Scheme
Example: M39
L0Rx0x0U3 ZE 6E
Device Type
M39 = Multichip package (Flash + LPDDR)
Flash 1 Architecture
L = Multilevel interface, multiple bank, burst mode
Flash 2 Architecture
0 = No die
Operating Voltage
R = V
DDF
= V
DDD
= V
DDQD
= V
DDQF
= 1.7V to 1.95V
Flash 1 Density
7 = 128Mb
8 = 256Mb
Flash 2 Density
0 = no die
LPDDR 1 Density
7 = 128Mb
9 = 512Mb
LPDDR 0 Density
0 = No Die
Boot Structure
U = Top ADMUX
Product Version
3 = 65nm technology multilevel interface, 70ns Flash; LPDDR
Package
ZE = 133-ball VFBGA, 8mm x 8mm, 0.5mm pitch
Temperature Range
6 = –40 to 85°C
Option
E = RoHS compliant package, standard packing
F = RoHS compliant package, tape and reel packing
