NXP Semiconductors
BTA412Y-600C
3Q Hi-Com Triac
BTA412Y-600C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 10 June 2014 6 / 13
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6 - - 2.1 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
in free air - 60 - K/W
003aab666
0
10
20
30
40
50
0 0.5 1 1.5 2
V
T
(V)
I
T
(A)
(1) (2) (3)
V
o
= 1.024 V; R
s
= 0.021 Ω
(1) T
j
= 125 °C; typical values
(2) T
j
= 125 °C; maximum values
(3) T
j
= 25 °C; maximum values
Fig. 6. On-state current as a function of on-state voltage
9. Isolation characteristics
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
T
mb
= 25 °C
- - 2500 V
C
isol
isolation capacitance from main terminal 2 to external
heatsink; f = 1 MHz; T
mb
= 25 °C
- 10 - pF