LTC2979
19
2979f
For more information www.linear.com/LTC2979
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC2979#packaging for the most recent package drawings.
BGA Package
144-Lead (12mm × 12mm × 1.29mm)
(Reference LTC DWG # 05-08-1967 Rev B)
(Y144AH)
PACKAGE TOP VIEW
4
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
SEE NOTES
D
E
b
e
e
b
F
G
BGA 144 1116 REV B
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
LTXXXXXX
DETAIL A
PIN 1
11 10 9 8 7 6 5 4 3 212 1
A
B
C
D
E
F
G
H
K
J
L
M
SUGGESTED PCB LAYOUT
TOP VIEW
0.0000
0.0000
0.35 ±0.025 Ø 144x
0.500
0.500
1.500
1.500
2.500
2.500
3.500
3.500
4.500
4.500
5.500
5.500
5.500
4.500
4.500
3.500
3.500
2.500
2.500
1.500
1.500
0.500
0.500
5.500
DETAIL A
Øb (144 PLACES)
A
DETAIL B
PACKAGE SIDE VIEW
Z
M
X YZddd
M
Zeee
A2
DETAIL B
SUBSTRATE
A1
ccc Z
MOLD
CAP
b1
// bbb Z
Z
H2
H1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS. DRAWING NOT TO SCALE
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
7
SEE NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
1.24
0.27
0.92
0.50
0.47
0.22
0.65
NOM
1.29
0.32
0.97
0.60
0.50
12.00
12.00
1.00
11.00
11.00
0.27
0.70
MAX
1.34
0.37
1.02
0.70
0.53
0.32
0.75
0.15
0.10
0.12
0.15
0.08
TOTAL NUMBER OF BALLS: 144
DIMENSIONS
NOTES
BALL HT
BALL DIMENSION
PAD DIMENSION
SUBSTRATE THK
MOLD CAP HT
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
