CM1440
http://onsemi.com
9
PACKAGE DIMENSIONS
WLCSP15, 2.36x1.05
CASE 567BP−01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.57
MILLIMETERS
A1
D 2.36 BSC
E
b 0.24 0.29
eD 0.400 BSC
0.72
D
E
A
B
PIN A1
REFERENCE
eD
A0.05 BC
0.03
C
0.05 C
15X
b
123
C
B
A
0.05 C
A
A1
A2
C
0.17 0.24
1.05 BSC
eE 0.347 BSC
PITCH
0.25
15X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.35
0.05 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
eE
A2 0.42 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
0.35
456 789
eD/2
OptiGuard Option
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CM1440/D
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