NLX1G58
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7
Figure 10. Voltage Waveforms Pulse Duration Figure 11. Voltage Waveforms Setup and Hold
Times
Figure 12. Voltage Waveforms Propagation Delay
Times Inverting and Noninverting Outputs
Figure 13. Voltage Waveforms Enable and
Disable Times Lowï and HighïLevel Enabling
Input
Input
Output
Output
V
M
V
LOAD
/2
V
M
t
W
V
I
0 V
V
M
V
M
V
M
V
M
V
M
V
M
V
I
0 V
t
PLH
t
PHL
t
PHL
t
PLH
V
OH
V
OL
V
OH
V
OL
Output
Control
V
I
0 V
V
M
V
M
V
M
V
M
t
PZH
t
PHZ
V
OL
V
OH
[0 V
Output
Output
Waveform 1
S1 at V
LOAD
(Note 1)
Waveform 2
S1 at GND
(Note 2)
V
I
0 V
Timing Input
Data Input
V
I
0 V
V
M
V
M
V
M
t
su
t
h
V
OL
+ V
D
V
OH
ï V
D
1. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
2. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control
3. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z
O
= 50 W.
4. The outputs are measured one at a time, with one transition per measurement.
5. All parameters are waveforms are not applicable to all devices.
ORDERING INFORMATION
Device Package Shipping
NLX1G58AMX1TCG ULLGA6 ï 0.5P
(PbïFree)
3000 / Tape & Reel
NLX1G58BMX1TCG ULLGA6 ï 0.4P
(PbïFree)
3000 / Tape & Reel
NLX1G58CMX1TCG ULLGA6 ï 0.35P
(PbïFree)
3000 / Tape & Reel
NLX1G58AMUTCG
(In Development)
UDFN6 ï 0.5P
(PbïFree)
3000 / Tape & Reel
NLX1G58BMUTCG
(In Development)
UDFN6 ï 0.4P
(PbïFree)
3000 / Tape & Reel
NLX1G58CMUTCG
(In Development)
UDFN6 ï 0.35P
(PbïFree)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NLX1G58
http://onsemi.com
8
PACKAGE DIMENSIONS
UDFN6 1.2x1.0, 0.4P
CASE 517AA
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For additional information on our PbïFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50
NLX1G58
http://onsemi.com
9
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L6X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 ïïï 0.15
DIMENSIONS: MILLIMETERS
0.30
6X
1.24
0.53
PITCH
*For additional information on our PbïFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
A2 0.07 REF
6X
A2
DETAIL B
DETAIL A

NLX1G58BMX1TCG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC CONFIG MULTIPLE FUNCT 6ULLGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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