10
Transmitted Data (I
2
C bus WRITE mode)
When the R/W bit in the chip is set to 0, the main
microprocessor can write on the system registers (SR1/SR2)
of the ISL6405 via I
2
C bus. These will be written by the
microprocessor as shown below. The spare bits of SR1/SR2
can be used for other functions.
TABLE 5. SYSTEM REGISTER (SR1 AND SR2) CONFIGURATION
SR DCL ISEL1 ENT1 LLC1 VSEL1 EN1 OLF1 FUNCTION
0 0 0 1 SR1 is selected
0 0 0 1 Vout1 = 13V, Vboost1 = 13V + Vdrop
0 0 1 1 Vout1 = 18V, Vboost1 = 18V + Vdrop
0 1 0 1 Vout1 = 14V, Vboost1 = 14V + Vdrop
0 1 1 1 Vout1 = 19V, Vboost1 = 19V + Vdrop
0 0 1 22kHz tone is controlled by DSQIN1 pin
0 1 1 22kHz tone is ON, DSQIN1 is disabled
0 0 1 Iout1 = 425mA max.
0 1 1 Iout1 = 775mA max.
0 1 1 Dynamic current limit NOT selected
0 0 1 Dynamic current limit selected
0 X X X X X 0 PWM and Linear for channel 1 disabled
SR ISEL2 ENT2 LLC2 VSEL2 EN2 OTF OLF2 FUNCTION
1 X X SR2 is selected
1 0 0 1 X X Vout2 = 13V, Vboost2 = 13V + Vdrop
1 0 1 1 X X Vout2 = 18V, Vboost2 = 18V + Vdrop
1 1 0 1 X X Vout2 = 14V, Vboost2 = 14V + Vdrop
1 1 1 1 X X Vout2 = 19V, Vboost2 = 19V + Vdrop
1 0 X X 22kHz tone is controlled by DSQIN2 pin
1 1 X X 22kHz tone is ON, DSQIN2 is disabled
1 0 X X Iout2 = 425mA max.
1 1 X X Iout2 = 775mA max.
1 X X X X 0 X X PWM and Linear for channel 2 disabled
ISL6405
11
Received Data (I
2
C bus READ MODE)
The ISL6405 can provide to the master a copy of the system
register information via the I
2
C bus in read mode. The read
mode is Master activated by sending the chip address with
R/W bit set to 1. At the following Master generated clock bits,
the ISL6405 issues a byte on the SDA data bus line (MSB
transmitted first).
At the ninth clock bit the MCU master can:
Acknowledge the reception, starting in this way the
transmission of another byte from the ISL6405.
Not acknowledge, stopping the read mode
communication.
While the whole register is read back by the microprocessor,
only the two read-only bits, OLF and OTF, convey diagnostic
information about the ISL6405.
After selection of SR1/SR2 ?
Power–On I
2
C Interface Reset
The I
2
C interface built into the ISL6405 is automatically reset
at power-on. The I
2
C interface block will receive a Power OK
logic signal from the UVLO circuit. This signal will go HIGH
when chip power is OK. As long as this signal is LOW, the
interface will not respond to any I
2
C commands and the
system register SR1 and SR2 are initialized to all zeros, thus
keeping the power blocks disabled. Once the Vcc rises
above UVLO, the POWER OK signal given to the I
2
C
interface block will be HIGH, the I
2
C interface becomes
operative and the SRs can be configured by the main
microprocessor. About 400mV of hysteresis is provided in
the UVLO threshold to avoid false triggering of the Power-
On reset circuit. (I
2
C comes up with EN = 0; EN goes HIGH
at the same time as (or later than) all other I
2
C data for that
PWM becomes valid).
ADDRESS Pin
Connecting this pin to GND the chip I
2
C interface address is
0001000, but, it is possible to choose between two different
addresses simply by setting this pin at one of the two fixed
voltage levels as shown in Table 8.
I
2
C Electrical Characteristics
TABLE 6. ADDRESS PIN CHARACTERISTICS
V
ADDR
MINIMUM TYPICAL MAXIMUM
V
ADDR
-1
“0001000”
0V - 2V
V
ADDR
-2
“0001001”
2.7V - 5V
TABLE 7. READING SYSTEM REGISTERS
DCL ISEL1/2 ENT1/2 LLC1/2 VSEL1/1 EN1/2 OTF2 OLF1/2 FUNCTION
These bits are read as they were after the last write operation. 0 T
J
130°C, normal operation
1T
J
> 150°C, power blocks disabled
0I
OUT
< I
MAX
, normal operation
1I
OUT
> I
MAX
, overload protection triggered
TABLE 8. I
2
C SPECIFICATIONS
PARAMETER TEST CONDITION MINIMUM TYPICAL MAXIMUM
Input Logic High, VIH SDA, SCL 0.7 x V
DD
Input Logic Low, VIL SDA, SCL 0.3 x V
DD
Input Logic Current, IIL SDA, SCL;
0.4V < V
IN
< 4.5V
10µA
SCL Clock Frequency 0 100kHz 400kHz
ISL6405
12
ISL6405
Small Outline Exposed Pad Plastic Packages (EPSOIC)
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AM BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010) BM M
α
P1
N
123
TOP VIEW
SIDE VIEW
BOTTOM VIEW
P
M28.3B
28 LEAD WIDE BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
SYMBOL
INCHES
NOTESMIN NOMINAL MAX
A 0.091 - 0.099 -
A1 0.001 - 0.005 -
B 0.014 - 0.019 9
C 0.0091 - 0.0125 -
D 0.701 - 0.711 3
E 0.292 - 0.299 4
e 0.050 BSC -
H 0.400 - 0.410 -
h 0.010 - 0.016 5
L 0.024 - 0.040 6
N287
α
-
P 0.180 0.214 0.218 11
P1 0.156 0.190 0.194 11
Rev. 0 5/02
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: INCH.
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count body size.

ISLUSBI2CKIT1Z

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Power Management IC Development Tools ISLUSBI2CKIT1Z EVAL KIT 1 RHS USB
Lifecycle:
New from this manufacturer.
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