LTC2956
25
2956fa
For more information www.linear.com/LTC2956
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ±0.10
(4-SIDES)
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
1
OR 0.25 × 45° CHAMFER
11 12
2
0.50 BSC
0.200 REF
2.10 ±0.05
±0.05
0.70 ±0.05
0.00 – 0.05
(UD12) QFN 0709 REV Ø
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
12-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1855 Rev Ø)